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A Preliminary Electron Backscatter Diffraction Study of Microstructures and Microtextures Evolution during Au Stud and Flip Chip Thermosonic Bonding

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Microstructures and microtextures of the gold wire, free air ball, Au stud bumps and flip chip bonding bumps were analyzed using Electron Backscatter Diffraction (EBSD). It is demonstrated that process parameters, such as bonding power, force and temperature have significant influences on the microstructure and microtexture of gold bumps. The non-uniform deformation, the associated microstructure defects and the local textures of the Au bumps under the vertical force and the horizontal ultrasonic wave applied are presented and discussed.

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Acknowledgements

The authors would like to thank Dr. Jun Qi for several valuable suggestions.

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Authors and Affiliations

  1. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, China

    Chun-Mei Li & Ping Yang

  2. ASM Assembly Automation Ltd. 4/F, Watson Centre, Kwai Chung, Hong Kong, China

    De-Ming Liu, Ngar-Chun Hung & Ming Li

Authors
  1. Chun-Mei Li
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  2. Ping Yang
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  3. De-Ming Liu
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  4. Ngar-Chun Hung
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  5. Ming Li
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Correspondence to Chun-Mei Li.

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Li, CM., Yang, P., Liu, DM. et al. A Preliminary Electron Backscatter Diffraction Study of Microstructures and Microtextures Evolution during Au Stud and Flip Chip Thermosonic Bonding. J. Electron. Mater. 36, 587–592 (2007). https://doi.org/10.1007/s11664-007-0108-6

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  • DOI: https://doi.org/10.1007/s11664-007-0108-6

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