Abstract
The effect of Al-trace dimension on electromigration of flip-chip solder joints was investigated. The Al trace dimension was found to have a significant influence on the electromigration failure time. When joints with Al traces 100 µm wide were stressed by 1.0 A at 100°C, failure times were 35 h, 1,700 h, and >3,000 h for joints with Al traces that were 2,550 µm, 1,700 µm, and 850 µm long, respectively. Solder joints with Al traces 40 µm wide and 2,550 µm long failed instantly at 0.6 A. The Joule heating effect was found to be responsible for the huge difference in failure time.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
International Technology Roadmap for Semiconductors, Assembly and Packaging Section (San Jose, CA: Semiconductor Industry Association, 2003), pp. 4–9.
K.N. Tu, J. Appl. Phys. 94, 5451 (2003).
S. Brandenburg and S. Yeh, Proc. Surface Mount International Conference and Exhibition, SMI 98, San Jose, CA, Aug. 23–27, 1998 (Edina, MN: SMTA, 1998), p. 337.
C.Y. Liu, C. Chen, C.N. Liao, and K.N. Tu, Appl. Phys. Lett. 75, 58 (1999).
T.Y.T. Lee, T.Y. Lee, and K.N. Tu, Proc. 51st Electronic Components and Technology Conference, IEEE Components, Packaging, and Manufacturing Technology Society (Piscataway, NJ: IEEE, 2001), p. 558.
T.L. Shao, S.H. Chiu, C. Chen, D.J. Yao, and C.Y. Hsu, J. Electron. Mater. 33, 1350 (2004).
J.R. Black, IEEE Trans. Electron Devices 16, 338 (1969).
J.D. Wu, P.J. Zheng, K. Lee, C.T. Chiu, and J.J. Lee, Proc. 52nd Electronic Components and Technology Conference, (Piscataway, NJ: IEEE, 2002), p. 452.
S.W. Liang, Y.W. Chang, and C. Chen, J. Electron. Mater. (in press).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Chiu, S.H., Chen, C. & Yao, D.J. Effect of Al trace dimension on electromigration failure time of flip-chip solder joints. J. Electron. Mater. 35, 1740–1744 (2006). https://doi.org/10.1007/s11664-006-0228-4
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/s11664-006-0228-4