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Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint

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Abstract

Due to the increased complexity and optimization in microprocessor packaging from 2D to 3D packages, the size of solder joints is being reduced significantly. This trend currently leads to an increased amount of current density across flip-chip solder joints as well as microbumps and causes electromigration-oriented void formation and subsequent failure of the solder joints. It has been observed from literature that solder material undergoes microstructure evolution and subsequent degradation of mechanical properties under isothermal aging conditions. The current study is based on the effects of material property degradation due to thermal aging of flip-chip Sn-Ag-Cu (SAC) solder joints on electromigration-oriented failure. Finite element analysis has been used to analyze the diffusion characteristics of a SAC solder joint under isothermal aging conditions of 100°C for a period of 1–20 days, and electromigration simulation has been performed at two different temperatures of 100°C and 125°C for 100 h at an input current range of 0.01–0.05 A. The effect of intermetallic compound (IMC) layer thickness is analyzed to reveal the impact on electromigration-oriented failure in isothermally 60 days long aged solder bumps. Results have revealed that resistance to electromigration-oriented failure is higher in the case of aged components compared to unaged components along with the increment of time to failure with IMC formation in the SAC solder joint.

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References

  1. J.H. Lau, J. Electron. Package 138, 030802 (2016).

    Article  Google Scholar 

  2. K.N. Tu, Solder Joint Technology (New York: Springer, 2007), pp. 211–243.

    Book  Google Scholar 

  3. J.R. Black, in IEEE Conference Proceedings (1969), pp. 338–347

  4. Y.H. Lin, C.M. Tsai, Y.C. Hu, Y.L. Lin, and C.R. Kao, J. Electron. Mater. 34, 27 (2005).

    Article  CAS  Google Scholar 

  5. H. Ma, J.C. Suhling, P. Lall, and M.J. Bozack, in IEEE Conference Proceedings (2006), pp 849–864.

  6. M. Motalab, Z. Cai, J. C. Suhling, J. Zhang, J.L. Evans, M.J. Bozack, and P. Lall, in IEEE Conference Proceedings (2012), pp. 513–531.

  7. M.M. Basit, M. Motalab, J.C. Suhling, Z. Hai, J.L. Evans, M.J. Bozack, and P. Lall, in IEEE Conference Proceedings (2015), pp. 106–117.

  8. M.S. Alam, KM.R. Hassan, J.C. Suhling, and P. Lall, in ASME Conference Proceedings (2018), pp. 8396:1–8396:19.

  9. P. Lall, D. Zhang, V. Yadav, and D. Locker, Microelectron. Reliab. 62, 4 (2016).

    Article  CAS  Google Scholar 

  10. A. Suzuki and Y. Mishin, J. Mater. Sci. 40, 3155 (2005).

    Article  CAS  Google Scholar 

  11. C. Basaran and M. Lin, Mech. Mater. 40, 66 (2008).

    Article  Google Scholar 

  12. Y. Liu, Y. Zhang, and L. Liang (2010), in IEEE Conference Proceedings (2010), pp. 544–552.

  13. Y.W. Chang, Y. Cheng, L. Helfen, F. Xu, T. Tian, M. Scheel, M.D. Michiel, C. Chen, K.N. Tu, and T. Baumbach, Sci. Rep. 7, 17950 (2017).

    Article  Google Scholar 

  14. S. Lin, Y. Liu, S.J. Chiu, Y.T. Liu, and H.Y. Lee, Sci. Rep. 7, 3082 (2017).

    Article  Google Scholar 

  15. Y. Zhang, Y. Liu, L. Liang, and X. Fan, Int. J. Mater. Struct. Integr. 6, 36 (2012).

    Article  Google Scholar 

  16. E.E. Antonova, D.C. Looman, in IEEE Conference Proceedings (2017), pp. 862–871.

  17. H. Ceric and S. Selberherra, in IEEE Conference Proceedings (2014), pp. 336-339.

  18. P. Dandu and X. Fan, in IEEE Conference Proceedings (2011), pp. 2192–2196.

  19. M. Pharr, K. Zhao, Z. Suo, F.Y. Ouyang, and P. Liu, J. Appl. Phys. 110, 083716 (2011).

    Article  Google Scholar 

  20. S. Wang, L. Liang, and Y. Liu, in IEEE Conference Proceedings (2006), pp. 1074–1083.

  21. B. Chao, S.H. Chae, X. Zhang, K.H. Lu, J. Im, and P.S. Ho, Acta Mater. 55, 2805 (2007).

    Article  CAS  Google Scholar 

  22. P. Dandu, X.J. Fan, and Y. Liu, in IEEE Conference Proceedings (2010), pp. 396-402.

  23. Y. Zhang, Eng. Trans. 63, 215 (2015).

    Google Scholar 

  24. Y.K. Cheng, C.H. Tsai, C.C. Teng, and S.M.S. Kang, Electrothermal Analysis of VLSI System (New York: Springer, 2002), pp. 121–155.

    Google Scholar 

  25. A.M. Maniatty, J. Ni, and Y. Liu, J. Appl. Mech. 83, 011010 (2016).

    Article  Google Scholar 

  26. F.X. Che, W.H. Zhu, E.S.W. Poh, X.W. Zhang, and X.R. Zhang, J. Alloys Compd. 507, 215 (2010).

    Article  CAS  Google Scholar 

  27. H. Mehrer, Diffusion in Solids: Fundamentals, Methods, Materials, Diffusion-Controlled Processes (New York: Springer, 2007), pp. 27–38.

    Book  Google Scholar 

Download references

Acknowledgments

The authors would like to thank the Department of Mechanical Engineering of BUET, Dhaka, for providing the computational facilities. The authors would also like to thank Bibekananda Datta, Washington State University, for support and encouragement with technical insights to conduct this work on electromigration.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Bangladesh University of Engineering and Technology, Dhaka, 1000, Bangladesh

    Md. Tusher Ahmed & Mohammad Motalab

  2. Department of Mechanical Engineering, Auburn University, Auburn, AL, 36830, USA

    Jeffrey C. Suhling

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  1. Md. Tusher Ahmed
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  2. Mohammad Motalab
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  3. Jeffrey C. Suhling
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Correspondence to Mohammad Motalab.

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Ahmed, M.T., Motalab, M. & Suhling, J.C. Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint. J. Electron. Mater. 50, 233–248 (2021). https://doi.org/10.1007/s11664-020-08514-y

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  • DOI: https://doi.org/10.1007/s11664-020-08514-y

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