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The anomalous microstructural, tensile, and aging response of thin-cast Sn3.9Ag0.6Cu lead-free solder

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Abstract

In this study, bulk and thin-cast samples were produced with an identical Sn3.9Ag0.6Cu composition. The thin-cast material exhibited a much finer as-quenched microstructure than the bulk material with the intermetallic compound (IMC) phase restricted to a thin network. Both the bulk and thincast materials continually softened during room-temperature aging, while both materials initially softened and then subsequently hardened when aged at 120°C and 180°C. The thin-cast material was in all cases significantly softer than the bulk material, and responded to aging as if it were bulk material aged at a higher temperature. These results have significant implications for the elevated temperature application of Sn3.9Ag0.6Cu.

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Authors and Affiliations

  1. Department of Mechanical Engineering, University of Wyoming, 82071, Laramie, WY

    Qiang Xiao & William D. Armstrong

  2. National Semiconductor Corporation, 95052, Santa Clara, CA

    Luu Nguyen

Authors
  1. Qiang Xiao
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  2. Luu Nguyen
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  3. William D. Armstrong
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Xiao, Q., Nguyen, L. & Armstrong, W.D. The anomalous microstructural, tensile, and aging response of thin-cast Sn3.9Ag0.6Cu lead-free solder. J. Electron. Mater. 34, 617–624 (2005). https://doi.org/10.1007/s11664-005-0074-9

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  • DOI: https://doi.org/10.1007/s11664-005-0074-9

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