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Phase formation and diffusion soldering in Pt/In, Pd/In, and Zr/Sn thin-film systems

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Abstract

Potential candidates for thin-film diffusion soldering were investigated by analysis of phase formation and measurements of mechanical and thermal stability of thin-film bonds. Bilayers of Pt/In, Pd/In, and Zr/Sn of 500 nm/500 nm thickness were prepared by direct current magnetron sputtering followed by a 5 nm, thin protective Au layer. Single bilayer samples were heat-treated between 200°C and 500°C for 3–30 min and studied by x-ray diffraction (XRD) analysis. Some bilayers were bonded face-to-face between 300°C and 500°C for 3–30 min and sheared-off either in shear-strength measurements at room temperature or in remelting experiments up to 1,100°C. Phase formation in Pd/In and Pt/In thin films is much faster than in Zr/Sn thin films. An interaction of Au in addition to a questionable thermal stability of PtIn2 complicated the reaction in Pt/In samples. A revised partial Pd-In phase diagram was constructed, correcting the compound ‘PdIn3’ to Pd3In7. The Pt/In and Pd/In thin-film systems are very promising candidates for thin-film diffusion soldering.

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  1. Institute of Metallurgy, Technical University of Clausthal, D-38678, Clausthal-Zellerfeld, Germany

    Thomas Studnitzky & Rainer Schmid-Fetzer

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  1. Thomas Studnitzky
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  2. Rainer Schmid-Fetzer
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Studnitzky, T., Schmid-Fetzer, R. Phase formation and diffusion soldering in Pt/In, Pd/In, and Zr/Sn thin-film systems. J. Electron. Mater. 32, 70–80 (2003). https://doi.org/10.1007/s11664-003-0239-3

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  • DOI: https://doi.org/10.1007/s11664-003-0239-3

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