Abstract
The effect of aging at 150°C on the microstructure and shear strength of SnAg/Cu surface mount solder joint has been investigated with comparison to 62Sn36Pb2Ag/Cu. It is found that the diffusion coefficient of intermetallic compounds at SnAg/Cu interface is smaller than that of intermetallic compounds at SnPbAg/Cu interface at 150°. The shear strength of SnAg solder joint is higher and decreases at a smaller rate during aging compared to that of SnPbAg solder joint. The fracture surface analysis shows that as the aging time increases, the fracture takes place along the solder/Cu6Sn5 interface with an extension toward the Sn−Cu intermetallic layer.
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Ahat, S., Sheng, M. & Luo, L. Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging. J. Electron. Mater. 30, 1317–1322 (2001). https://doi.org/10.1007/s11664-001-0118-8
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DOI: https://doi.org/10.1007/s11664-001-0118-8