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Effect of thermal cycles on interface and mechanical property of low-Ag Sn1.0Ag0.5Cu(nano-Al)/Cu solder joints

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Abstract

Low-Ag content SnAgCu solder has drawn more and more researchers’ attention due to the low cost. In this paper, the effect of 0.1 wt% nano-Al particles on interface reaction between Sn1.0Ag0.5Cu and Cu substrate was investigated, and the growth of intermetallic compounds (IMC) and mechanical property of solder joints during − 55 to 125 °C thermal cycling were also analyzed. The results show that the Cu6Sn5 IMC formed at the as-soldered interface and grow obviously with the increase of thermal cycling. The growth rate of IMC in the SnAgCu–0.1Al/Cu is lower than that of SnAgCu/Cu, which indicates that the nano-Al particles can inhibit the diffusion coefficient of IMC layers. Moreover, the shear force of two kinds of solder joints decrease during thermal cycling, but the shear force of SnAgCu–0.1Al is higher than that of SnAgCu.

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References

  1. H.J. Ji, M.G. Li, S. Ma, M.Y. Li, Ni3Sn4-composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging. Mater. Des. 108, 590–596 (2016)

    Article  CAS  Google Scholar 

  2. L. Sun, L. Zhang, Properties and microstructures of Sn-Ag-Cu-X lead-free solder joints in electronic packaging. Adv. Mater. Sci. Eng. 2015, 1–16 (2015)

    Google Scholar 

  3. Z. Sheng, Prediction on Thermal Fatigue Life & Study on the Reliability of QFP Soldered Joint[D]. (Nanjing University of Aeronautics and Astronautics, Nanjing, 2012)

    Google Scholar 

  4. S. Tian, S.P. Li, J. Zhou, P. Xue, R.H. Cao, F.J. Wang, Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn-0.7Cu solder joints. J. Mater. Sci.: Mater. Electron. 28(21), 16120–16132 (2017)

    CAS  Google Scholar 

  5. Y.L. Wang, G.X. Wang, K.X. Song, K.K. Zhang, Effect of Ni addition on the wettability and microstructure of Sn2.5Ag0.7Cu0.1RE solder alloy. Mater. Des. 119, 219–224 (2017)

    Article  CAS  Google Scholar 

  6. M.N. Wang, J.Q. Wang, H. Feng, K. Wang, Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder. J. Mater. Sci.: Mater. Electron. 23(1), 148–155 (2012)

    CAS  Google Scholar 

  7. L. Zhang, J.G. Han, C.W. He, Y.H. Guo, Reliability behavior of lead-free solder joints in electronic components. J. Mater. Sci.: Mater. Electron. 24(1), 172–190 (2013)

    CAS  Google Scholar 

  8. C.D. Zou, Y.L. Gao, B. Yang, Q.J. Zhai, Nanoparticles of Sn3.0Ag0.5Cu alloy synthesized at room temperature with large melting temperature depression. J. Mater. Sci.: Mater. Electron. 23(1), 2–7 (2012)

    CAS  Google Scholar 

  9. L. Zhang, S.B. Xue, G. Zeng, L.L. Gao, H. Ye, Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging. J. Alloys Compd. 510(1), 38–45 (2012)

    Article  CAS  Google Scholar 

  10. A. Sharma, Y.J. Jang, J.B. Kim, J.P. Jung, Thermal cycling, shear and insulating characteristics of epoxy embedded Sn-3.0Ag-0.5Cu (SAC305) solder paste for automotive applications. J. Alloys Compd. 704, 795–803 (2017)

    Article  CAS  Google Scholar 

  11. Y. Liu, F.L. Sun, H.W. Zhang, P.F. Zou, Solderability, IMC evolution, and shear behavior of low-Ag Sn0.7Ag0.5Cu-BiNi/Cu solder joint. J. Mater. Sci.: Mater. Electron. 23(9), 1705–1710 (2012)

    CAS  Google Scholar 

  12. L. Sun, L. Zhang, L. Xu, S.J. Zhong, J. Ma, L. Bao, Effect of nano-Al addition on properties and microstructure of low-Ag-content Sn-1Ag-0.5Cu solders. J. Mater. Sci.: Mater. Electron. 27(7), 7665–7673 (2016)

    CAS  Google Scholar 

  13. A. Sharif, Y.C. Chan, M.N. Islam, Dissolution of electroless Ni metallization by lead-free solder alloys. J. Alloys Compd. 388(1), 75–82 (2005)

    Article  CAS  Google Scholar 

  14. A.K. Gain, T. Fouzder, Y.C. Chan, K.C. Winco, Yung, Microstructure, kinetic analysis and hardness of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solder on OSP-Cu pads. J. Alloys Compd. 509(7), 3319–3325 (2011)

    Article  CAS  Google Scholar 

  15. B.L. Chen, G.Y. Li, An investigation of effects of Sb on the intermetallic formation in Sn-3.5Ag-0.7Cu solder joints. IEEE Trans. Compon. Packag. Technol. 28(3), 534–541 (2005)

    Article  CAS  Google Scholar 

  16. A.K. Gain, T. Fouzder, Y.C. Chan, A. Sharif, N.B. Wong, W.K.C. Yung, The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads. J. Alloys Compd. 506(1), 216–223 (2010)

    Article  CAS  Google Scholar 

  17. S. Tian, S.P. Li, J. Zhou, F. Xue, Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy. J. Alloys Compd. 742, 835–843 (2018)

    Article  CAS  Google Scholar 

  18. P. Liu, P. Yao, J. Liu, Evolutions of the interface and shear strength between SnAgCu-xNi solder and Cu substrate during isothermal aging at 150°C. J. Alloys Compd. 486(1–2), 474–479 (2009)

    Article  CAS  Google Scholar 

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (No. 51475220), Six Talent Peaks project in Jiangsu Province (No. XCL022), Qing Lan project and State Key Laboratory of Advanced Brazing Filler Metals & Technology (No. SKLABFMT201503).

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Authors and Affiliations

  1. College of Mechanical & Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, China

    Lei Sun, Ming-he Chen & Chun-chun Wei

  2. School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou, 221116, China

    Liang Zhang & Fan Yang

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  1. Lei Sun
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  2. Ming-he Chen
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  3. Chun-chun Wei
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  4. Liang Zhang
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Correspondence to Ming-he Chen.

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Sun, L., Chen, Mh., Wei, Cc. et al. Effect of thermal cycles on interface and mechanical property of low-Ag Sn1.0Ag0.5Cu(nano-Al)/Cu solder joints. J Mater Sci: Mater Electron 29, 9757–9763 (2018). https://doi.org/10.1007/s10854-018-9014-3

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  • DOI: https://doi.org/10.1007/s10854-018-9014-3

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