Abstract
Previous research showed that tensile fracture strain increases as temperature increases for AA2519 with Mg and Ag additions, because the void-sheet coalescence stage of microvoid fracture is retarded. The present work characterizes intravoid-strain localization (ISL) between primary voids at large constituents and secondary-void nucleation at small dispersoids, two mechanisms that may govern the temperature dependence of void sheeting. Most dispersoids nucleate secondary voids in an ISL band at 25 °C, promoting further localization, while dispersoid-void nucleation at 150 °C is greatly reduced. Increased strain-rate hardening with increasing temperature does not cause this behavior. Rather, a stress relaxation model predicts that flow stress and strain hardening decrease with increasing temperature or decreasing strain rate due to a transition from dislocation accumulation to diffusional relaxation around dispersoids. This transition to softening causes a sharp increase in the model-predicted applied plastic strain necessary for dispersoid/matrix interface decohesion. This reduced secondary-void nucleation and reduced ISL at elevated temperature explain retarded void sheeting and increased fracture strain.
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Haynes, M.J., Gangloff, R.P. Temperature-dependent void-sheet fracture in Al-Cu-Mg-Ag-Zr. Metall Mater Trans A 29, 1599–1613 (1998). https://doi.org/10.1007/s11661-998-0084-3
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DOI: https://doi.org/10.1007/s11661-998-0084-3