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Oxidization-Induced Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0Er Alloy

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Abstract

Rapid tin whisker growth has been found in Sn-3.8Ag-0.7Cu1.0Er solder joints. The morphology of the tin whiskers changes from rodlike to threadlike when the storage temperature increases from 25 °C to 150 °C. The compressive stress induced by the lattice expansion of the oxidized ErSn3 phase provides the driving force and the tin atoms released from the oxidization of the ErSn3 phase provide the material source for the tin whisker growth.

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Acknowledgment

The authors greatly appreciate the financial support from the key program for the 11th Five-Year Plan (Grant No.2006BAE03B02) of the China Department of Science and Technology.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, People’s Republic of China

    Hu Hao (Professor), Yaowu Shi (Professor), Zhidong Xia (Professor), Yongping Lei (Professor) & Fu Guo (Professor)

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  1. Hu Hao
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  2. Yaowu Shi
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  3. Zhidong Xia
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  4. Yongping Lei
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  5. Fu Guo
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Corresponding author

Correspondence to Hu Hao.

Additional information

Manuscript submitted June 27, 2008.

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Hao, H., Shi, Y., Xia, Z. et al. Oxidization-Induced Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0Er Alloy. Metall Mater Trans A 40, 2016–2021 (2009). https://doi.org/10.1007/s11661-009-9871-8

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  • DOI: https://doi.org/10.1007/s11661-009-9871-8

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