Abstract
A methodology to control interfacial microstructures, while suppressing formation of Al4C3 in wrought Al alloy composites reinforced with SiC, was demonstrated. Thermodynamic calculations were carried out to elucidate how one can select process parameters in terms of alloy composition and fabrication temperature to obtain intended interfaces. Experimental verifications were conducted using scanning electron microscopy (SEM) and transmission electron microscopy (TEM) to validate calculated results. The reaction mechanisms for forming various interfaces were identified both theoretically and experimentally. Evaluations of the interfacial bonding strengths and interfacial stability at elevated temperatures were also carried out for various interface types.
Similar content being viewed by others
References
J. Narciso, C. Garcia-Cordovilla, and E. Louis: Mater. Sci. Eng., 1992, vol. B15, p. 148.
A.C. Ferro and B. Derby: Acta Metall. Mater., 1995, vol. 43, p. 3061.
J.C. Viala, P. Fortier, and J. Bouix: J. Mater. Sci., 1990, vol. 25, p. 1842.
F.H. Samuel, H. Liu, and A.M. Samuel: Metall. Trans. A, 1993, vol. 24, pp. 1631–45.
T. Iseki, T. Kameda, and T. Maruyama: J. Mater. Sci., 1984, vol. 19, p. 1692.
J.C. Lee, S.B. Park, H.W. Seok, C.S. Oh, and H.I. Lee: Acta Metall. Mater., 1998, vol. 46, p. 2635.
D.C. Halverson, A.J. Pyzik, I.A. Aksay, and W.E. Snowden: J. Am. Ceram. Soc., 1989, vol. 72, p. 775.
O. Yucei and A. Tekin: Ceram. Int., 1997, vol. 23, p. 149.
K.T. Ramesh and G. Ravichandran: Mech. Mater., 1990, vol. 10, p. 19.
S.G. Warrier, C.A. Blue, and R.Y. Lin: J. Mater. Sci., 1993, vol. 28, p. 760.
Z. Wang and R.J. Zhang: Acta Metall. Mater., 1994, vol. 42, p. 1433.
CRC Handbook of Chemistry and Physics, 74th ed., CRC Press, Boca Raton, FL, 1992, pp. 4–36.
The MERCK INDEX, 10th ed., Merck & Co., Inc., Rahway, N.J., 1983, p. 50.
D.J. Lloyd, H. Lagace, A. McLeod, and P.L. Morris: Mater. Sci. Eng., 1989, vol. A107, p. 73.
G. Gonzalez, L. Salvo, M. Seury, and G.L. Eserance: Scripta Metall., 1995, vol. 33, p. 1969.
H. Ribes, M. Suery, G. L’sperance, and T.G. Legoux: Metall. Trans. A, 1990, vol. 21A, pp. 2489–96.
Y.Q. Wang and B.L. Zhou: Composites, 1996, vol. 27A, p. 1339.
Y.Q. Wang, J.H. Zhang, Z.M. Wang, and B.L. Zhou: Acta Metall. Sinica, 1994, vol. 30, p. 194.
W.M. Zhong, G. L’esperance, and M. Suery: Metall. Mater. Trans. A, 1995, vol. 26, pp. 2637–50.
C. Zweben: JOM, 1992, July, p. 15.
J.C. Lee, J.Y. Byun, S.B. Park, and H.I. Lee: Acta Metall. Mater., 1998, vol. 46, p. 1771.
D.R. Gaskell: Introduction to Metallurgical Thermodynamics, 2nd ed., McGraw-Hill Book Co., New York, NY, 1981, p. 287.
L. Kaufman and H. Bernstein: Computer Calculation of Phase Diagrams, Academic Press, New York, NY, 1970.
N. Saunders and A.P. Miodownik: CALPHAD (Calculation of Phase Diagrams): A Comprehensive Guide, Elsevier Science, New York, NY, 1998.
I. Barin: Thermodynamic Data of Pure Substances, VCH Verlagsge-sellschaft mbH, Weinheim, 1989.
K. Wu and Z. Jin: CALPHAD, 1997, vol. 21, p. 411.
A.T. Dinsdale: CALPHAD, 1991, vol. 15, p. 317.
N. Saunders: COST-507, unpublished research, Thermotech Ltd., Surrey, UK, 1991.
N. Chakraborti and H.L. Lukas: CALPHAD, 1992, vol. 16, p. 79.
A. Jansson: Metall. Trans. A, 1992, vol. 23A, pp. 2953–62.
Y. Zuo and and Y.A. Chang: CALPHAD, 1993, vol. 17, p. 161.
D. Lüdecke: CALPHAD, 1987, vol. 11, p. 135.
Y. Zuo and Y.A. Chang: Z. Metallkd., 1993, vol. 84, p. 662.
J.E. Tibballs: SI Norway Internal Report No. 890221-5, 1991.
D. Lüdecke: Z. Metallkd., 1986, vol. 77, p. 278.
S.L. Chen, Y. Zuo, H. Liang, and Y.A. Chang: Metall. Mater. Trans. A, 1997, vol. 28A, pp. 435–46.
B. Sundman, B. Jansson, and J.O. Andersson: CALPHAD, 1985, vol. 9, p. 153.
J.C. Lee, J.I. Lee, and H.I. Lee: Scripta Metall., 1996, vol. 35, p. 721.
K.B. Kim and E.P. Yoon: Mater. Sci. Technol., 1995, vol. 11, p. 629.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Lee, JC., Lee, HI., Ahn, JP. et al. Methodology to design the interfaces in SiC/Al composites. Metall Mater Trans A 32, 1541–1550 (2001). https://doi.org/10.1007/s11661-001-0241-4
Received:
Issue Date:
DOI: https://doi.org/10.1007/s11661-001-0241-4