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Mode III fracture problem of an arbitrarily oriented crack in an FGPM strip bonded to a homogeneous piezoelectric half plane

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Abstract

This paper studies the Mode III electric-elastic field of a cracked functionally graded piezoelectric strip bonded to a homogeneous piezoelectric half plane. The crack is oriented in arbitrary direction. The material properties of the strip vary along the strip thickness in exponential forms. By using the Fourier transform, the problem can be formulated to a system of singular integral equations and solved by applying the Gauss-Chebyshev integration formula. The effects come from the edge, crack orientations and the nonhomogeneous material parameter on intensity factors are discussed graphically.

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Authors and Affiliations

  1. Department of Mechanical Engineering, National Cheng Kung University, No. 1, Dasyue Road, 70101, Tainan, Taiwan

    Wei-Hung Hsu & Ching-Hwei Chue

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  1. Wei-Hung Hsu
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  2. Ching-Hwei Chue
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Correspondence to Ching-Hwei Chue.

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Hsu, WH., Chue, CH. Mode III fracture problem of an arbitrarily oriented crack in an FGPM strip bonded to a homogeneous piezoelectric half plane. Meccanica 44, 519–534 (2009). https://doi.org/10.1007/s11012-008-9188-5

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  • DOI: https://doi.org/10.1007/s11012-008-9188-5

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