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Curing reaction of o-cresol-formaldehyde epoxy/LC epoxy(p-PEPB)/anhydride(MeTHPA)

Cure kinetics and molecular mechanism

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Abstract

The curing kinetics of a bi-component system about o-cresol-formaldehyde epoxy resin (o-CFER) modified by liquid crystalline p-phenylene di[4-(2,3-epoxypropyl) benzoate] (p-PEPB), with 3-methyl-tetrahydrophthalic anhydride (MeTHPA) as a curing agent, were studied by non-isothermal differential scanning calorimetry (DSC) method. The relationship between apparent activation energy E a and the conversion α was obtained by the isoconversional method of Ozawa. The reaction molecular mechanism was proposed. The results show that the values of E a in the initial stage are higher than other time, and E a tend to decrease slightly with the reaction processing. There is a phase separation in the cure process with LC phase formation. These curing reactions can be described by the Šesták–Berggren (S–B) equation, the kinetic equation of cure reaction as follows: \( {\frac{{{\text{d}}\alpha }}{{{\text{d}}t}}} = A\exp \left( { - {\frac{{E_{\text{a}} }}{RT}}} \right)\alpha^{m} \left( {1 - a} \right)^{n} \).

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Acknowledgements

This article is the project supported by Natural Science Foundation (B2005000108) of Hebei Province, China.

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  1. College of Chemistry and Environmental Science, Hebei University, 071002, Baoding, China

    Jungang Gao, X. Zhang, L. Huo & H. Zhao

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  1. Jungang Gao
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  2. X. Zhang
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  3. L. Huo
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  4. H. Zhao
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Correspondence to Jungang Gao.

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Gao, J., Zhang, X., Huo, L. et al. Curing reaction of o-cresol-formaldehyde epoxy/LC epoxy(p-PEPB)/anhydride(MeTHPA). J Therm Anal Calorim 100, 225–232 (2010). https://doi.org/10.1007/s10973-009-0629-8

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  • DOI: https://doi.org/10.1007/s10973-009-0629-8

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