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Curing and thermal behaviour of epoxy resin in the presence of a mixture of imide-amines

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Abstract

The curing behaviour of diglycidyl ether of bisphenol-A (DGEBA) was investigated by the dynamic differential scanning calorimetry using varying molar ratios of aromatic imide-amines and 4,4′-diaminodiphenylsulfone (DDS). The imide-amines were prepared by reacting 1 mole of naphthalene 1,4,5,8-tetracarboxylic dianhydride (N) and 4,4′-oxodiphthalic anhydride (O) with 2.5 moles of 4,4′-diaminodiphenyl ether (E) or 4,4′-diaminodiphenyl methane (M) or 4,4′-diaminodiphenylsulfone (S) and designated as NE/OE or NM/OM or NS/OS. The mixture of the imide-amines and DDS at ratio of 0:1, 0.25:0.75, 0.5:0.5, 0.75:0.25 and 1:0 were used to investigate the curing behaviour of DGEBA.

A single exotherm was observed on curing with mixture of imide-amines and DDS. This clearly shows that the two amines act as co-curing agents. Curing temperatures were higher with imide-amines having sulfone linkage irrespective of anhydride. Curing of DGEBA with mixture of imide-amines and or DDS resulted in a decrease in characteristic curing temperatures. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was higher in case of resins cured imide-amines based on N and E. The activation energy of decomposition and integral procedural decomposition temperature were also calculated from the TG data.

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Authors and Affiliations

  1. School of Basic and Applied Sciences, Guru Gobind Singh Indraprastha University, Kashmere Gate, Delhi, 110006, India

    P. Sharma & A. K. Narula

  2. Centre of Polymer Science and Engineering, Indian Institute of Technology, Hauz Khas, New Delhi, 110016, India

    V. Choudhary

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  1. P. Sharma
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  2. V. Choudhary
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  3. A. K. Narula
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Sharma, P., Choudhary, V. & Narula, A.K. Curing and thermal behaviour of epoxy resin in the presence of a mixture of imide-amines. J Therm Anal Calorim 94, 805–815 (2008). https://doi.org/10.1007/s10973-007-8982-y

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  • DOI: https://doi.org/10.1007/s10973-007-8982-y

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