Abstract
CBRAM nano-ionic devices are emerging as a competitive technology solution for transistor free memory, offering low power consumption, fast switching, and non-volatility. However, due to the process by which switching is achieved in these devices, namely stochastic growth of a conductive filament bridging the two electrodes within the amorphous material between the electrodes, they suffer from reliability problems. In this work we present devices built with a nanotube structure of chalcogenide glasses to confine the growing conductive bridge. This structure is found to greatly improve device reliability and switching speed. Furthermore, the technology does not involve additional steps, is cost-effective, and is fully compatible with conventional CMOS technology. We have verified the process of conductive bridge growth with scanning electron microscopy and atom force microscopy and characterized the devices in terms of their current–voltage characteristics, memory window, endurance, and retention, all of which show excellent parameters. Their performance stability is also demonstrated at 130 °C, while multilevel switching is established by application of a variety of compliance currents.
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References
G.E. Moore, IEEE Trans. Solid State Circ. News. 11, 33 (2006)
M.T. Bohr, IEEE Trans. Nanotechnol. 1, 56 (2002)
J. Alsmeier, G. Samachisa, US Patent 8,349,681, (2013)
Y.S. Kim, D.J. Lee, C.K. Lee, H.K. Choi, S.S. Kim, J.H. Song et al., 2010 IEEE International in Reliability Physics Symposium (IRPS), 599 (2010)
S.R. Ovshinsky, Phys. Rev. Lett. 21, 1450 (1968)
M.J. Kang, T.J. Park, Y.W. Kwon, D.H. Ahn, Y.S. Kang, H. Jeong et al., IEEE Electron. Devices Meeting Tech. Digest 39, 11 (2011)
L. Bo, Data storage at the nanoscale, in Advances and Applications, ed. by G. Fuxi, W. Yang (CRC Press, Taylor and Francis publishing group, 2015), p. 463
K.M. Kim et al., Sci. Rep. 6, 20085 (2016)
M.N. Kozicki, H.J. Barnaby, Semicond. Sci. Technol. 31, 113001 (2016)
M.N. Kozicki, M. Mitkova, I. Valov, in Electrochemical Metallization Memories, ed. D. Ielmini, R. Waser (Wiley-VCH Verlag GmbH & Co. KGaA, 2016), p. 483
I. Valov, M.N. Kozicki, J. Phys. D Appl. Phys. 46, 074005 (2013)
U. Russo, D. Kamalanathan, D. Ielmini, A.L. Lacaita, M.N. Kozicki, IEEE Trans. Electron Devices 56(5), 1040 (2009)
H.Y. Cheng, M. BrightSky, S. Raoux, C.F. Chen, P.Y. Du, J.Y. Wu, Y.Y. Lin, T.H. Hsu, Y. Zhu, S. Kim, H.L. Lung, C. Lam, IEEE International Electron Devices Meeting (Washington, DC, 2013), pp. 30–36
A. Bunde, J.W. Kantelhar, in Diffusion in Condensed Matter (Springer, Berlin, 2005), 895
S. Choi, S.H. Tan, Z. Li, Y. Kim, C. Choi, P.-Y. Chen. H. Yeon, S. Yu, J. Kim, Nat. Mat. 17, 335 (2018)
D.B. Strukov, Nat. Mat. 17, 293 (2018)
S. Choi, S.H. Tan, Z. Li, Y. Kim, C. Choi, P.-Y. Chen, H. Yeon, S. Yu, J. Kim, Suppl. Inf. Nat. Mater. 17, 335, (2018). https://doi.org/10.1038/s41563-017-0001-5https1038/s41563-017-0001-5
M.R. Latif, D. Tenne, M. Mitkova, J. Mater. Sci.: Mater. Electron. (2018). https://doi.org/10.1007/s10854-018-0521-z
C.A. Spence, S.R. Elliott, Phys. Rev. B 39, 5452 (1989)
E. Marquez, A.M. Bernal-Oliva, J.M. Gonzalez-Leal, R. Prieto, Alcón, R. Jiménez-Garay, J. Non-Cryst. Sol. 222, 250 (1997)
C. Li, S. Minne, B. Pittenger, A. Mednick, M. Guide, T. Nguyen, Bruker application note AN132 Rev. A, (2011)
H. Lee, P. Chen, T. Wu, Y. Chen, C. Wang, P. Tzeng et al., in Electron Devices Meeting, 2008. IEDM 2008. IEEE International, 1 (2008)
Y.S. Chen, T.Y. Wu, P.J. Tzeng, P.S. Chen, H.Y. Lee, C.H. Lin et al. in VLSI Technology, Systems, and Applications, 2009. International Symposium on VLSI-TSA’09, 37, (2009)
M.N. Kozicki, M. Park, M. Mitkova, IEEE Trans. Nanotechnol. 4, 331 (2005)
C. Cheng, A. Chin, F. Yeh, 2010 Symposium on VLSI Technology (VLSIT), 85 (2010)
J.B. Allen, R.F. Larry, Electrochemical methods: fundamentals and applications. Department of Chemistry and Biochemistry University of Texas at Austin, John Wiley & Sons, Inc, (2001)
C.H. Hamann, A. Hamnett, W. Vielstich, Electrochemistry (Wiley-VCH, Weinheim, 1998)
X. Guo, C. Schindler, S. Menzel, R. Waser, Appl. Phys. Lett. 91, 133513 (2007)
C.-Y. Wu, X.-H. Qian, M.-S. Cheng, Y.-A. Liang, W.-M. Chen, IEEE J. Solid State Circuits 49, 2397 (2014)
P.T. Talole, S.T. Sawale, Int. J. Comput. Appl. 1, 24, (2010)
Data Sheet, K9XXG08UXM (2005)
Data Sheet, 48F3300L0YDQ0 (2003)
Data Sheet, HYB18T1G400 (2006)
M. Kund, G. Beitel, C.-U. Pinnow, T. Rohr, J. Schumann, R. Symanczyk et al., in Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International, 754 (2005)
N. Derhacobian, S.C. Hollmer, N. Gilbert, M.N. Kozicki, Proceedings of the IEEE, 98, 283, (2010)
D. Kamalanathan, U. Russo, D. Ielmini, M.N. Kozicki, Electron Device Lett. IEEE 30, 553 (2009)
C. Schindler, M. Meier, R. Waser, M. Kozicki, in Non-Volatile Memory Technology Symposium, 2007. NVMTS’07, 82, (2007)
C. Schindler, S.P. Thermadam, R. Waser, M.N. Kozicki, E. Devices, Transactions on IEEE 54, 2762 (2007)
S. Rahaman, S. Maikap, in Proceedings of IMW, 2010, 70, (2010)
C. Liaw, M. Kund, D. Schmitt-Landsiedel, I. Ruge, in Solid State Device Research Conference, 2007. ESSDERC 2007. 37th European, 226 (2007)
Acknowledgements
This work was partially supported by funding through Idaho State Board of Education under Grant No. IF14-004. Authors acknowledge the participation in this work of Jason Nielsen, who conducted the AFM measurements.
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Latif, M.R., Davis, P.H., Knowton, W.B. et al. CBRAM devices based on a nanotube chalcogenide glass structure. J Mater Sci: Mater Electron 30, 2389–2402 (2019). https://doi.org/10.1007/s10854-018-0512-0
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DOI: https://doi.org/10.1007/s10854-018-0512-0