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Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection

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Abstract

Silver electrical conductive adhesive (ECA) was prepared by silane capping and ball milling treatment to apply in through-hole filling for PCB (Printed Circuit Board) isolated layer connection. The characteristics of ECA were investigated by scanning electron microscopy, X-ray diffraction, fourier transform infrared spectroscopy and thermal gravimetric analysis. The results showed that as-contained silver flakes preferred to uniformly distribute in ECA adhesive even after 30 days reserve and the bulk resistivity of cured ECA reached 1.8 × 10−4 Ω cm. In addition of high thermal reliability, this prepared ECA demonstrated an excellent performances to apply in through-hole filling for PCB interconnection.

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Authors and Affiliations

  1. State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054, People’s Republic of China

    Guoyun Zhou, Yingjie Mao, Chong Wang, Shouxu Wang, Yuanming Chen & Wei He

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  1. Guoyun Zhou
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  2. Yingjie Mao
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  3. Chong Wang
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  4. Shouxu Wang
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  5. Yuanming Chen
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  6. Wei He
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Correspondence to Wei He.

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Zhou, G., Mao, Y., Wang, C. et al. Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection. J Mater Sci: Mater Electron 27, 9186–9190 (2016). https://doi.org/10.1007/s10854-016-4955-x

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  • DOI: https://doi.org/10.1007/s10854-016-4955-x

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