Abstract
In this study, Cu–Sn alloy was electrodeposited from aqueous electrolytic bath onto Mo electrode. Before electrodeposition, some calculations using MATLAB software to obtain the dominant complex of Cu–citrate in different pH values and cyclic voltammetry (CV) experiments was performed. The potential range in which the alloy electrodeposition process could be carried out in a solution containing CuSO4, SnSO4, and Na3C6H5O7 was determined by CV. In addition, the effects of boric acid and cetyl trimethyl ammonium bromide (CTAB) surfactant on codeposition potential were studied. The microstructural properties and alloy composition were investigated by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS), respectively. Alloy composition up to 49.5 at.% of Sn was obtained. Alloy composition of 33 at.% Sn corresponding to Cu2SnS3 was obtained at solution containing 0.04 M SnSO4, 0.02 M CuSO4 and 0.4 M Na3C6H5O7 at Potential −0.75 V.
Similar content being viewed by others
References
J.H. Choi, Mater. Sci. Eng. A 550, 183 (2012)
P. De Vreese, A. Skoczylas, E. Matthijs, J. Fransaer, K. Binnemans, Electrochim. Acta 108, 788 (2013)
J. Liu, F. Li, C. Liu, H. Wang, B. Ren, K. Yang, E. Zhang, Mater. Sci. Eng. C 35, 392 (2014)
M.R. Khelladi, L. Mentar, A. Azizi, L. Makhloufi, G. Schmerber, A. Dinia, J. Mater. Sci. Mater. Electron. 23, 2245 (2012)
U. Sarac, R.M. Öksüzoğlu, M.C. Baykul, J. Mater. Sci. Mater. Electron. 23, 2110 (2012)
I. Marković, S. Nestorović, D. Marković, Mater. Des. 53, 137 (2014)
R. Lei, S. Xu, M. Wang, H. Wang, Mater. Sci. Eng. A 586, 367 (2013)
B. Zhao, Y. Zhang, J. Yang, J. Mater. Sci. Mater. Electron. 24, 4439 (2013)
Y. Sürme, A.A. Gürten, E. Bayol, E. Ersoy, J. Alloy. Compd. 485, 98 (2009)
I. Volov, X. Sun, G. Gadikota, P. Shi, A.C. West, Electrochim. Acta 89, 792 (2013)
D. Padhi, S. Gandikota, H.B. Nguyen, C. McGuirk, S. Ramanathan, J. Yahalom, G. Dixit, Electrochim. Acta 48, 935 (2003)
A. Survila, Z. Mockus, R. Juškėnas, V. Jasulaitienė, J. Appl. Electrochem. 31, 1109 (2001)
K. Junpei, C. Kotaro, A. Naoya, A. Hideaki, N. Ryota, J. Kazuo, K. Hironori, Jpn. J. Appl. Phys. 51, 10NC34 (2012)
P.A. Fernandes, P.M.P. Salomé, A.F.D. Cunha, J. Phys. D Appl. Phys. 43, 215403 (2010)
D.M. Berg, R. Djemour, L. Gütay, G. Zoppi, S. Siebentritt, P.J. Dale, Thin Solid Films 520, 6291 (2012)
N. Aihara, H. Araki, A. Takeuchi, K. Jimbo, H. Katagiri, Phys. Status Solidi. C 10, 1086 (2013)
C. Han, Q. Liu, D.G. Ivey, Electrochim. Acta 54, 3419 (2009)
W. Tang, Y. Hu, S. Huang, Met. Mater. Int. 18, 177 (2012)
E. Çadırlı, U. Böyük, S. Engin, H. Kaya, N. Maraşlı, M. Arı, J. Mater. Sci. Mater. Electron. 21, 468 (2010)
D.H. Nam, R.H. Kim, D.W. Han, H.S. Kwon, Electrochim. Acta 66, 126 (2012)
X.H. Weihua Pu, Jianguo Ren, Chunrong Wan, Changyin Jiang, in: 6th Advanced Batteries and Accumulators (ABA), 2005
J.-Y.E. Jung-Won Park, H.-S. Kwon, Int. J. Electrochem. Sci. 6, 3093 (2011)
S.D. Beattie, J.R. Dahn, J. Electrochem. Soc. 150, C457 (2003)
K.I. Murase, S. Akira, I. Takashi, S. Hiroyuki, J. Electrochem. Soc. 158, 335 (2011)
A. Mehdi, M.M. Bagheri, E. Hosein, Phys. Scr. 85, 035603 (2012)
Y.-T. Hsieh, C.-C. Tai, I.-W. Sun, Meet. Abstr. 53, MA2010 (2010)
C.T.J. Low, F.C. Walsh, J. Electroanal. Chem. 615, 91 (2008)
Y. Goh, A.S.M.A. Haseeb, M.F.M. Sabri, Electrochim. Acta 90, 265 (2013)
A.N. Correia, M.X. Façanha, P. de Lima-Neto, Surf. Coat. Technol. 201, 7216 (2007)
N. Pewnim, S. Roy, Electrochim. Acta 90, 498 (2013)
G.A. Finazzi, E.M. de Oliveira, I.A. Carlos, Surf. Coat. Technol. 187, 377 (2004)
Q.L. Chunfen Han, Douglas G. Ivey, in: CS MANTECH Conference, Austin, Texas, USA, 2007
A. He, Q. Liu, D. Ivey, J. Mater. Sci. Mater. Electron. 19, 553 (2008)
F.I.L. Tzec, G. Oskam, ECS Trans. 25, 195 (2010)
R.Y. Ying, P.K. Ng, Z. Mao, R.E. White, J. Electrochem. Soc. 135, 2964 (1988)
C. Han, Q. Liu, D.G. Ivey, Electrochim. Acta 53, 8332 (2008)
D. Sinkeviciute, J. Baltrusaitis, N. Dukstiene, J. Sol. State Electrochem. 15, 711 (2011)
E. Gómez, E. Pellicer, E. Vallés, J. Electroanal. Chem. 580, 222 (2005)
Z. Zheng-zhong, Z. Xiao-rong, Z. Chao, Wuhan Univ. J. Nat. Sci. 4, 211 (1999)
M. Rezaei, M. Ghorbani, A. Dolati, Electrochim. Acta 56, 483 (2010)
N. Zech, D. Landolt, Electrochim. Acta 45, 3461 (2000)
M. Paunovic, M. Schlesinger, Fundamentals of Electrochemical Deposition, 2nd edn. (Wiley, London, 2006)
Y.D. Gamburg, G. Zangari, Theory and Practice of Metal Electrodeposition (Springer, New York, 2011)
Acknowledgments
The authors are grateful to Amirkabir University of Technology and Esfarayen University of Technology for their support.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Heidari, G., Mousavi Khoie, S.M., Abrishami, M.E. et al. Electrodeposition of Cu–Sn alloys: theoretical and experimental approaches. J Mater Sci: Mater Electron 26, 1969–1976 (2015). https://doi.org/10.1007/s10854-014-2636-1
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-014-2636-1