Skip to main content
SpringerLink
Log in

Electrical and mechanical properties of multiwalled carbon nanotubes-reinforced solderable polymer nanocomposites

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

In recent years, carbon nanotubes have attracted attention as potential reinforcement materials for composites. Because there is a current lack of research investigating the electrical and mechanical properties of multiwalled carbon nanotube (MWCNT)-reinforced solderable polymer nanocomposites (SPNs), this study focuses on the influence of MWCNT concentration on the interconnection properties of SPN joints. Six types of MWCNT-reinforced SPNs with 40 vol.% of a low-melting point alloy (LMPA) and chemically functionalized MWCNTs (ranging from 0 to 2 wt%) were formulated. Our results indicate that a wide and stable conduction path was formed for all MWCNT concentrations due to the excellent coalescence and wetting behavior of the molten LMPA. However, the interconnection properties degraded with increasing MWCNT content due to an increase in the number of internal defects that were caused by the polymer matrix becoming trapped in the LMPA joints.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9

Similar content being viewed by others

References

  1. D.D. Lu, Y.G. Li, C.P. Wong, J. Adhes. Sci. Technol. 22, 815–834 (2008)

    Article  Google Scholar 

  2. Y. Li, C.P. Wong, Mat. Sci. Eng. R 51, 1–35 (2006)

    Article  Google Scholar 

  3. E. Sancaktar, L. Bai, Polymers 3, 427–466 (2011)

    Article  Google Scholar 

  4. H.W. Cui, D.S. Li, Q. Fan, H.X. Lai, Int. J. Adhes. Adhes. 44, 232–236 (2013)

    Article  Google Scholar 

  5. S. Xu, D.A. Dillard, J.G. Dillard, Int. J. Adhes. Adhes. 23, 235–250 (2003)

    Article  Google Scholar 

  6. S. Kotthaus, B.H. Gunther, R. Haug, H. Schafer, IEEE Trans. Compon. Packag. Manuf. Technol. A 20, 15–20 (1997)

    Article  Google Scholar 

  7. H.H. Lee, K.S. Chou, Z.W. Shih, Int. J. Adhes. Adhes. 25, 437–441 (2005)

    Article  Google Scholar 

  8. H.P. Wu, X.J. Wu, M.Y. Ge, G.Q. Zhang, Y.W. Wang, J. Jiang, Compos. Sci. Technol. 67, 1182–1186 (2007)

    Article  Google Scholar 

  9. F. Marcq, P. Demont, P. Monfraix, A. Peigney, Ch. Laurent, T. Falat, F. Courtade, T. Jamin, Microelectron. Reliab. 51, 1230–1234 (2011)

    Article  Google Scholar 

  10. H. Jiang, M.J. Yim, W. Lin, C.P. Wong, IEEE Trans. Compon. Packag. Technol. 32, 754–758 (2009)

    Article  Google Scholar 

  11. S. Yu, M.N. Tong, G. Critchlow, J. Appl. Polym. Sci. 111, 2957–2962 (2009)

    Article  Google Scholar 

  12. P.C. Ma, B.Z. Tang, J.K. Kim, Carbon 46, 1497–1505 (2008)

    Article  Google Scholar 

  13. Z. Wu, J. Li, D. Timmer, K. Lozano, S. Bose, Int. J. Adhes. Adhes. 29, 488–494 (2009)

    Article  Google Scholar 

  14. B.S. Yim, J.M. Kim, S.H. Jeon, S.H. Lee, J. Kim, J.G. Han, M. Cho, Mater. Trans. 50, 2649–2655 (2009)

    Article  Google Scholar 

  15. B.S. Yim, J.M. Kim, Mater. Trans. 51, 2329–2331 (2010)

    Article  Google Scholar 

  16. B.S. Yim, J.I. Lee, Y. Heo, J. Kim, S.H. Lee, Y.E. Shin, J.M. Kim, Mater. Trans. 53, 2104–2110 (2012)

    Article  Google Scholar 

  17. Y. Hwang, M. Kim, J. Kim, Thin Solid Films 545, 116–123 (2013)

    Article  Google Scholar 

  18. J. Diaz, G. Paolicelli, S. Ferrer, F. Comin, Phys. Rev. B 54, 8064–8069 (1996)

    Article  Google Scholar 

  19. W.P. Yang, D. Costa, P. Marcus, J. Electrochem. Soc. 141, 2669–2676 (1994)

    Article  Google Scholar 

  20. D. Yang, A. Velamakanni, G. Bozoklu, S. Park, M. Stoller, R.D. Piner, S. Stankovich, I. Jung, D.A. Field, C.A. Ventrice Jr, R.S. Ruoff, Carbon 47, 145–152 (2009)

    Article  Google Scholar 

  21. G. Zhang, S. Sun, D. Yang, J.P. Dodelet, E. Sacher, Carbon 46, 196–205 (2008)

    Article  Google Scholar 

  22. J. Shen, W. Huang, L. Wu, Y. Hu, M. Ye, Compos. Sci. Technol. 67, 3041–3050 (2007)

    Article  Google Scholar 

  23. L. Aryasomayajula, K.J. Wolter, J. Nanotechnol. 2013, 296517 (2013)

    Google Scholar 

  24. S.Y. Lee, S.J. Park, Bull. Korean Chem. Soc. 31, 1596–1600 (2010)

    Article  Google Scholar 

  25. P.C. Ma, N.A. Siddiqui, G. Marom, J.K. Kim, Compos. Part A-Appl. S 41, 1345–1367 (2010)

    Article  Google Scholar 

  26. W. Zou, Z.J. Du, Y.X. Liu, X. Yang, H.Q. Li, C. Zhang, Compos. Sci. Technol. 68, 3259–3264 (2008)

    Article  Google Scholar 

  27. S.S. Rahatekar, K.K.K. Koziol, S.A. Butler, J.A. Elliott, M.S.P. Shaffer, M.R. Mackley, A.H. Windle, J. Rheol. 50, 599–610 (2006)

    Article  Google Scholar 

  28. W. Bauhofer, J.Z. Kovacs, Compos. Sci. Technol. 69, 1486–1498 (2009)

    Article  Google Scholar 

  29. X. Chen, J. Wang, M. Lin, W. Zhong, T. Feng, X. Chen, J. Chen, F. Xue, Mat. Sci. Eng. A-Struct. 492, 236–242 (2008)

    Article  Google Scholar 

  30. M.S.P. Shaffer, X. Fan, A.H. Windle, Carbon 36, 1603–1612 (1998)

    Article  Google Scholar 

  31. X.F. Li, K.T. Lau, Y.S. Yin, Compos. Sci. Technol. 68, 2876–2881 (2008)

    Article  Google Scholar 

  32. A. Eitan, K. Jiang, D. Dukes, R. Andrews, L.S. Schadler, Chem. Mater. 15, 3198–3201 (2003)

    Article  Google Scholar 

  33. M. Abdalla, D. Dean, D. Adibempe, E. Nyairo, P. Robinson, G. Thompson, Polymer 48, 5662–5670 (2007)

    Article  Google Scholar 

  34. H. Peng, L.B. Alemany, J.L. Margrave, V.N. Khabashesku, J. Am. Chem. Soc. 125, 15174–15182 (2003)

    Article  Google Scholar 

  35. M.R. Ayatollahi, S. Shadlou, M.M. Shokrieh, Eng. Fract. Mech. 78, 2620–2632 (2011)

    Article  Google Scholar 

  36. M. Shtein, R. Nadiv, N. Lachman, H.D. Wagner, O. Regev, Compos. Sci. Technol. 87, 157–163 (2013)

    Article  Google Scholar 

  37. Y.J. Kim, T.S. Shin, H.D. Choi, J.H. Kwon, Y.C. Chung, H.G. Yoon, Carbon 43, 23–30 (2005)

    Article  Google Scholar 

  38. M. Moniruzzaman, K.I. Winey, Macromolecules 39, 5194–5205 (2006)

    Article  Google Scholar 

  39. J.W. Baek, K.S. Jang, Y.S. Eom, J.T. Moon, J.M. Kim, J.D. Nam, Microelectron. Eng. 87, 1968–1972 (2010)

    Article  Google Scholar 

Download references

Acknowledgments

This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT and future Planning (2014007164).

Author information

Authors and Affiliations

  1. School of Mechanical Engineering, Chung-Ang University, Seoul, 156-756, Republic of Korea

    Byung-Seung Yim & Jong-Min Kim

Authors
  1. Byung-Seung Yim
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Jong-Min Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Jong-Min Kim.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Yim, BS., Kim, JM. Electrical and mechanical properties of multiwalled carbon nanotubes-reinforced solderable polymer nanocomposites. J Mater Sci: Mater Electron 26, 1678–1689 (2015). https://doi.org/10.1007/s10854-014-2592-9

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-014-2592-9

Keywords

Search

Navigation