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The combined effects of ultrasonic wave and electric field on the microstructure and properties of Sn2.5Ag0.7Cu0.1RE/Cu soldered joints

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Abstract

The effect of ultrasonic wave (USW) and electric field (E) on the solderability of Sn2.5Ag0.7Cu0.1RE/Cu was investigated. Compared with the sample soldered conventionally, the solder joint obtained with USW and E assisted resulted in significant changes in the microstructure. The thickness and roughness of the interfacial Cu6Sn5 intermetallic compound (IMC) layer decreased by 39 and 56 %, respectively. The shear strength of the solder joint increased by 68 %, and the fracture mechanism of the solder joint transformed from brittle fracture occurred in the interfacial IMC layer to ductile fracture occurred in the solder alloy. The results reveal that reliable soldering of Sn2.5Ag0.7Cu0.1RE/Cu can be achieved with USW and E assisted, despite of low-halogen flux.

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Acknowledgments

The work was supported by the Natural Science Foundation of China (50774029) and (U1204520), Science and Technology Innovation Team of Henan Province, and Science and Technology Innovation Team Support Plan of Henan University (13IRTSTHN003).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China

    Keke Zhang, Xiaojiao Zhang, Ranfeng Qiu, Hongxin Shi & Yujie Liu

  2. Collaborative Innovation Center of Nonferrous Metals, Luoyang, 471023, China

    Keke Zhang

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  1. Keke Zhang
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  2. Xiaojiao Zhang
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  3. Ranfeng Qiu
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  4. Hongxin Shi
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Correspondence to Keke Zhang.

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Zhang, K., Zhang, X., Qiu, R. et al. The combined effects of ultrasonic wave and electric field on the microstructure and properties of Sn2.5Ag0.7Cu0.1RE/Cu soldered joints. J Mater Sci: Mater Electron 25, 1681–1686 (2014). https://doi.org/10.1007/s10854-014-1783-8

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  • DOI: https://doi.org/10.1007/s10854-014-1783-8

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