Abstract
In this work, multiwalled carbon nanotubes (MWCNTs) were successfully enwrapped by a thin layer of tetra-nitrophthalocyanine copper (CuPc) via solvent-thermal method. EDS spectrum shows that the hybrid materials are mainly composed of C, Cu, N and O elements. TEM images exhibit that the MWCNT was wholly coated with a layer of CuPc and micro-nanoscale core–shell CuPc@MWCNTs were formed. FTIR reveals the detailed chemical groups of micro-nanoscale core–shell CuPc@MWCNTs. Thereafter, CuPc@MWCNTs/polyarylene nitrile ethers (PEN) composite films were prepared via solution-casting method. The CuPc@MWCNTs/PEN composite films possess excellent thermal and mechanical properties endowed by PEN matrix. The glass transition temperature of the composite films is about 175 °C and the initial decomposition temperature is in the range of 494–499 °C. Besides, the tensile modulus of the composite films is above 70 MPa. Furthermore, the dielectric constant of the composite film with 5.0 wt% CuPc@MWCNTs loading is 31 at 50 Hz while the dielectric loss is 0.58 at 50 Hz.
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-013-1692-2/MediaObjects/10854_2013_1692_Fig1_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-013-1692-2/MediaObjects/10854_2013_1692_Fig2_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-013-1692-2/MediaObjects/10854_2013_1692_Fig3_HTML.jpg)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-013-1692-2/MediaObjects/10854_2013_1692_Fig4_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-013-1692-2/MediaObjects/10854_2013_1692_Fig5_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-013-1692-2/MediaObjects/10854_2013_1692_Fig6_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-013-1692-2/MediaObjects/10854_2013_1692_Fig7_HTML.gif)
Similar content being viewed by others
References
R. Ulrich, Circuit. World. 30, 20 (2004)
H. Wang, W. Zhong, P. Xu, Q. Du, Macromol. Mater. Eng. 289, 793 (2004)
Y. Rao, C. Wong, J. Appl. Polym. Sci. 92, 2228 (2004)
A. Maliakal, H. Katz, P. Cotts, S. Subramoney, P. Mirau, J. Am. Chem. Soc. 127, 14655 (2005)
R. Schroeder, A. Majewski, M. Grell, Adv. Mater. 17, 1535 (2005)
S. Znoiko, V. Maizilish, G. Shaposhnikov, N. Lebedeva, E. Mal’kova, Russ. J. Phys. Chem. A 87, 352 (2013)
Y. Bae, N. Lee, T. Kim, H. Cho, C. Lee, L. Fleet, A. Hirohata, Nanoscale Res. Lett. 7, 650 (2012)
S. Karan, B. Mallik, Thin Solid Films 520, 2343 (2012)
J. Schon, Z. Bao, J. Appl. Phys. 89, 3526 (2001)
X. Liu, S. Long, D. Luo, W. Chen, G. Cao, Mater. Lett. 62, 19 (2008)
X. Yang, Y. Zhan, J. Yang, H. Tang, F. Meng, J. Zhong, R. Zhao, X. Liu, Polym. Int. 61, 880 (2012)
Z. Guo, C. Shao, M. Zhang, J. Mu, Z. Zhang, P. Zhang, B. Chen, Y. Liu, J. Mater. Chem. 21, 12083 (2011)
H. Tang, Z. Ma, J. Zhong, J. Yang, R. Zhao, X. Liu, Colloids Surf. A 384, 311 (2011)
X. Huang, Z. Pu, L. Tong, Z. Wang, X. Liu, J. Mater. Sci.: Mater. Electron. 23, 2089 (2012)
Y. Zhan, X. Yang, H. Guo, J. Yang, F. Meng, X. Liu, J. Mater. Chem. 22, 5602 (2012)
Y. Zhan, X. Yang, F. Meng, Y. Lei, J. Zhong, R. Zhao, X. Liu, Polym. Int. 60, 1342 (2011)
Z. Pu, H. Tang, X. Huang, J. Yang, Y. Zhan, R. Zhao, X. Liu, Colloids Surf. A 415, 125 (2012)
H. Tang, X. Huang, X. Yang, J. Yang, R. Zhao, X. Liu, Mater. Lett. 75, 218 (2012)
H. Tang, J. Yang, J. Zhong, R. Zhao, X. Liu, Mater. Lett. 65, 2758 (2011)
H. Qian, A. Bismarck, E. Greenhalgh, G. Kalinka, M. Shaffer, Chem. Mater. 20, 1862 (2008)
E. Thostenson, W. Li, D. Wang, Z. Ren, T. Chou, J. Appl. Phys. 91, 6034 (2002)
S. Xie, B. Zhu, Z. Xu, Y. Xu, Mater. Lett. 59, 2403 (2005)
F. Meng, X. Huang, H. Tang, Z. Pu, X. Liu, J. Mater. Sci.: Mater. Electron. 24, 3652 (2013)
X. Huang, Z. Pu, M. Feng, L. Tong, X. Liu, Mater. Lett. 96, 139 (2013)
Acknowledgments
The authors wish to thank for financial support of this work from the National Natural Science Foundation (Nos. 51173021, 51373028) and “863” National Major Program of High Technology (2012AA03A212).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Long, Y., Liu, X. Dielectric, mechanical and thermal properties of novel core–shell CuPc@MWCNTs/PEN composite films. J Mater Sci: Mater Electron 25, 1089–1096 (2014). https://doi.org/10.1007/s10854-013-1692-2
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-013-1692-2