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Silver content effect on rheological and electrical properties of silver pastes

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Abstract

The novelty of this work is laboratory formulation of environmentally friendly, water-based silver inks adapted for screen printing. The challenge was also to elaborate inks that can withstand temperatures as high as 900 °C. Indeed, when printed on ceramic substrate, they were sintered at these high temperatures. These inks can replace conductive silver pastes present in the market, today, and containing irritant solvents such as terpineol and other aromatic solvents. Besides, screen printing is considered as an additive technique, thus allowing reducing wastes. Furthermore, only with 72.5% silver, considered as low content compared to commercial inks (≥75%), prepared inks presented good electrical resistivity, 23 nΩ m, close to that of bulk silver resistivity, 16 nΩ m. Formulation of silver inks with spherical particles, 2–3 μm mean diameter, was performed. The aim of the study was to determine silver content effect on pastes rheological behaviour, lines properties (width, thickness and roughness) and electrical properties. Therefore, rheological behaviour of inks was studied; in particular, Casson and Bingham models were applied in order to determine the yield stress. Viscosity evolution as a function of shear rate was also determined. Besides, the thixotropic behaviour of inks was highlighted. Inks were then screen printed on alumina sintered substrates and cured at different temperatures during 15 min. Topography measurements were performed. Line resistivity as small as 35 nΩ m was measured on cured lines. These inks, printed on ceramic tapes, can be used to print microwave transmission lines, for which resistivities lower than 1 mΩ m are requested.

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References

  1. G.M. Kim, M.A.F. van den Boogaart, J. Brugger, Microelectron. Eng. 67–68, 609–614 (2003)

    Article  Google Scholar 

  2. R. Parashkov, E. Becker, T. Riedl, H.-H. Johannes, W. Kowalsky, Proc. IEEE 93(7), 1321–1329 (2005)

    Article  CAS  Google Scholar 

  3. A. Sanson, E. Mercadelli, E. Roncari, R. Licheri, R. Orru, G. Cao, E. Merlone-Borla, D. Marzorati, A. Bonavita, G. Micali, G. Neri, Ceram. Int. 36, 521–527 (2010)

    Article  CAS  Google Scholar 

  4. W. Yin, D.-H. Lee, J. Choi, C. Park, S. Min Cho, Korean J. Chem. Eng. 25(6), 1358–1361 (2008)

    Article  CAS  Google Scholar 

  5. A.A. Yussuf, I. Sbarski, M. Solomon, N. Tran, J.P. Hayes, J. Mater. Process. Technol. 189(1–3), 401–408 (2007)

    Article  CAS  Google Scholar 

  6. R.M. Pemberton, F.J. Rawson, J. Xu, R. Pittson, G.A. Drago, J. Griffiths, S.K. Jackson, J.P. Hart, Microchim. Acta. 170, 321–330 (2010)

    Article  CAS  Google Scholar 

  7. R.M. Pemberton, J. Xu, R. Pittson, G.A. Drago, J. Griffiths, S.K. Jackson, J.P. Hart, Biosens. Bioelectron. 26, 2448–2453 (2010)

    Article  Google Scholar 

  8. G. Guo, W. Gan, F. Xiang, J. Zhang, H. Zhou, H. Liu, J. Luo, J. Mater Sci. Mater Electron 22, 527–530 (2011)

    Article  CAS  Google Scholar 

  9. M. Yamamoto, H. Kakiuchi, Y. Kashiwagi, Y. Yoshida, Bull. Chem. Soc. Jpn. 83(11), 1386–1391 (2010)

    Article  CAS  Google Scholar 

  10. S. Jagtap, V. Deshpande, V. Rane, S. Rane, G. Phatak, D. Amalnerkar, J. Mater. Sci. Mater. Electron. 19, 522–527 (2008)

    Article  CAS  Google Scholar 

  11. S. Datta, K. Keller, D.L. Schulz, D.C. Webster, IEEE Trans. Compon. Packag. Manuf. Technol. 1(1), 69–75 (2011)

    Article  CAS  Google Scholar 

  12. T.-X. Liang, W.Z. Sun, Y.H. Wang, H.-D. Li, IEEE Trans. Compon. Packag. Manuf. Technol. Part B 19(2), 423–426 (1996)

    Article  CAS  Google Scholar 

  13. Y. Wang, G. Zhang, J. Ma, Mater. Sci. Eng. B94, 48–53 (2002)

    Article  CAS  Google Scholar 

  14. C. Zhong, C. Duan, F. Huang, H. Wu, Y. Cao, Chem. Mater. Rev. 23, 326–340 (2011)

    Article  CAS  Google Scholar 

  15. W. Songping, J. Mater. Sci. Mater. Electron. 18(4), 447–452 (2007)

    Article  Google Scholar 

  16. S. Merilampi, T. Laine-Ma, P. Ruuskanen, Microelectron. Reliab. 49, 782–790 (2009)

    Article  CAS  Google Scholar 

  17. N. Midoux, Mécaniques et rhéologie des fluides en génie chimique ENSIC—Tec & Doc (1993)

  18. T. Maeder, Introduction aux pâtes/encres de sérigraphie en technologie de couches épaisses. (Ecole Polytechnique Fédérale de Lausanne, 2008)

  19. R.H. Leach, R.J. Pierce, The Printing Ink Manual (Kluwer, Dordrecht, 1993)

    Book  Google Scholar 

  20. L. Shiyong, W. Ning, X. Wencai, L. Yong, Mater. Chem. Phys. 111, 20–23 (2008)

    Article  Google Scholar 

  21. J.W. Goodwin, R.W. Hughes, Rheology for Chemists: An Introduction. Royal Society of Chemistry (2008)

  22. M. Neidert, W. Zhang, D. Zhang, A. Kipka, A.—PVSC—Hereaus-voltaics.com (2008)

  23. S.B. Rane, P.K. Khanna, T. Seth, G.J. Phatak, D.P. Amalnerkar, B.K. Das, Mater. Chem. Phys. 82, 237–245 (2003)

    Article  CAS  Google Scholar 

  24. D. Buzby, A. Dobie, Hereaus White Papers (2011)

  25. S.L. Morisette, J.A. Lewis, J. Am. Ceram. Soc. 84(11), 2462–2468 (2001)

    Article  Google Scholar 

  26. S. Rane, V. Puri, J. Mater. Sci. Mater. Electron. 11, 667–674 (2000)

    Article  CAS  Google Scholar 

Download references

Acknowledgments

We would like to thank the European Union for financial support through the MULTILAYER project (FP7-NMP4-2007-214122), B. Khelifi form Grenoble INP—Pagora for performing the SEM images and J. Stiernstedt from Swerea IVF for providing us by LTCC tapes.

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Correspondence to Rita Faddoul.

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Faddoul, R., Reverdy-Bruas, N. & Bourel, J. Silver content effect on rheological and electrical properties of silver pastes. J Mater Sci: Mater Electron 23, 1415–1426 (2012). https://doi.org/10.1007/s10854-011-0607-3

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  • DOI: https://doi.org/10.1007/s10854-011-0607-3

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