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Synthesis of silver nanorods and application for die attach material in devices

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Abstract

Silver nanorods have been successfully synthesized in high yield by a polyol process in the presence of FeCl3. The yield and morphology of the silver particles from these conditions were dependant on the concentration of FeCl3, and the molar ratio of the capping agent to AgNO3. The optimized conditions for the synthesis of the nanorods were: 20 μM of FeCl3 and a molar ratio of 1.8:1 of capping agent to AgNO3. The nanorods produced were used to form a silver layer at 400 °C with a low electrical resistivity of 6.1 × 10−6 Ω cm. The silver layer was applied as die-attachment films to connect a SiC chip to a copper substrate. This formed a porous structure, which was evaluated for structure and strength.

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Acknowledgments

The authors are gratefully acknowledged Professor S. Isoda and M. Adachi for helpful discussions. We would like to thank Dr. Ohashi and Dr. Arai for their help in preparing the work. This work was performed as a part of Development of Inverter Systems for Power Electronics project supported by the NEDO (New Energy and Industrial Technology Development Organization, Japan).

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Authors and Affiliations

  1. Institute of Scientific and Industrial Research, Osaka University, Ibaraki, Osaka, 567-0047, Japan

    Jinting Jiu, Keiichi Murai, Keunsoo Kim & Katsuaki Suganuma

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  1. Jinting Jiu
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  2. Keiichi Murai
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  3. Keunsoo Kim
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  4. Katsuaki Suganuma
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Correspondence to Jinting Jiu.

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Jiu, J., Murai, K., Kim, K. et al. Synthesis of silver nanorods and application for die attach material in devices. J Mater Sci: Mater Electron 21, 713–718 (2010). https://doi.org/10.1007/s10854-009-9983-3

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  • DOI: https://doi.org/10.1007/s10854-009-9983-3

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