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High-performance polyamide-imide films and electrospun aligned nanofibers from an amide-containing diamine

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Abstract

Polyamide-imides (PAIs) are highly desired in many applications because of their superior thermal and mechanical properties. In this work, PAI was prepared from an amide-containing diamine and dianhydride by polycondensation and thermal treatment. Both PAI films and aligned electrospun nanofibers (ANFs) were fabricated. FT-IR was used to determine the structure formation of PAI at different annealing temperatures. DSC and TGA were used to evaluate the thermal properties of PAI, while tensile test was applied to evaluate the mechanical properties of PAI films and ANFs. The results indicated that the PAI possessed both outstanding thermal stability and mechanical properties, which provide opportunities for applications in gas separation, high temperature filtration, reinforcement, etc.

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Acknowledgements

Natural Science Foundation of Jiangsu Province of China (BK20180770); National Natural Science Foundation of China (51803093, 21574060 and 21374044); Major Special Projects of Jiangxi Provincial Department of Science and Technology (20114ABF05100); Technology Plan Landing Project of Jiangxi Provincial Department of Education (GCJ2011-24).

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Authors and Affiliations

  1. College of Materials Science and Engineering, Nanjing Forestry University, Nanjing, 210037, China

    Gaigai Duan & Shaohua Jiang

  2. College of Chemistry and Chemical Engineering, Jiangxi Normal University, Nanchang, 330027, China

    Shuwu Liu & Haoqing Hou

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  1. Gaigai Duan
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  2. Shuwu Liu
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  4. Haoqing Hou
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Correspondence to Shaohua Jiang or Haoqing Hou.

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Duan, G., Liu, S., Jiang, S. et al. High-performance polyamide-imide films and electrospun aligned nanofibers from an amide-containing diamine. J Mater Sci 54, 6719–6727 (2019). https://doi.org/10.1007/s10853-019-03326-w

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