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Application of Ni and Cu nanoparticles in transient liquid phase (TLP) bonding of Ti-6Al-4V and Mg-AZ31 alloys

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Abstract

The transient liquid phase (TLP) bonding of Ti-6Al-4V alloy to a Mg-AZ31 alloy was performed using an electrodeposited Ni coating containing a dispersion of Ni and Cu nanoparticles. Bond formation was attributed to two mechanisms; first, solid-state diffusion of Ni and Mg, followed by liquid eutectic formation at the Mg-AZ31 interface. Second, the solid-state diffusion of Ni and Ti at the Ti-6Al-4V interface resulted in a metallurgical joint. The joint interface was characterized by scanning electron microscopy, energy dispersive X-ray spectroscopy, and X-ray diffraction analysis. Microhardness and shear strength tests were used to investigate the mechanical properties of the bonds. The use of Cu nanoparticles as a dispersion produced the maximum joint shear strength of 69 MPa. This shear strength value corresponded to a 15 % enhancement in joint strength compared to TLP bonds made without the use of nanoparticles dispersion.

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Acknowledgements

The authors would like to acknowledge The German Jordanian University (GJU), and NSERC Canada for the financial support for this research.

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Authors and Affiliations

  1. Department of Mechanical and Manufacturing Engineering, University of Calgary, Calgary, AB, T2N 1N4, Canada

    Anas M. Atieh & Tahir I. Khan

  2. Qatar Petroleum Chair, Department of Mechanical and Industrial Engineering, University of Qatar, Doha, Qatar

    Tahir I. Khan

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  1. Anas M. Atieh
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  2. Tahir I. Khan
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Correspondence to Anas M. Atieh.

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Atieh, A.M., Khan, T.I. Application of Ni and Cu nanoparticles in transient liquid phase (TLP) bonding of Ti-6Al-4V and Mg-AZ31 alloys. J Mater Sci 49, 7648–7658 (2014). https://doi.org/10.1007/s10853-014-8473-z

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  • DOI: https://doi.org/10.1007/s10853-014-8473-z

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