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Thermal expansion coefficient and thermal fatigue of discontinuous carbon fiber-reinforced copper and aluminum matrix composites without interfacial chemical bond

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Abstract

Fully dense carbon fiber-reinforced copper and aluminum matrix (Cu–CF and Al–CF) composites were fabricated by hot press without the need for an interfacial chemical compound. With 30 vol% carbon fiber, the thermal expansion coefficients (TECs) of pure Cu and Al were decreased to 13.5 × 10−6 and 15.5 × 10−6/K, respectively. These improved TECs of Cu–CF and Al–CF composites were maintained after 16 thermal cycles; moreover, the TEC of the 30 vol% Cu–CF composite was stable after 2500 thermal cycles between −40 and 150 °C. The thermal strain caused by the TEC mismatch between the matrix and the carbon fiber enables mechanical enhancement at the matrix/carbon fiber interface and allows conservation of the improved TECs of Cu–CF and Al–CF composites after thermal cycles.

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Acknowledgements

The authors would like to thank the “Délégation Générale pour l’Armement” and “Région Aquitaine” for financial support.

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Authors and Affiliations

  1. Institut de Chimie de la Matière Condensée de Bordeaux, ICMCB-CNRS, Université de Bordeaux, 87 Avenue du Docteur Albert Schweitzer, 33608, Pessac Cedex, France

    Grégory Lalet, Hiroki Kurita, Jean-Marc Heintz, Guillaume Lacombe & Jean-François Silvain

  2. Department of Materials Processing, Graduate School of Engineering, Tohoku University, Sendai, 980-8579, Japan

    Grégory Lalet & Akira Kawasaki

Authors
  1. Grégory Lalet
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  2. Hiroki Kurita
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  3. Jean-Marc Heintz
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  4. Guillaume Lacombe
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  5. Akira Kawasaki
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  6. Jean-François Silvain
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Correspondence to Hiroki Kurita.

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Lalet, G., Kurita, H., Heintz, JM. et al. Thermal expansion coefficient and thermal fatigue of discontinuous carbon fiber-reinforced copper and aluminum matrix composites without interfacial chemical bond. J Mater Sci 49, 397–402 (2014). https://doi.org/10.1007/s10853-013-7717-7

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  • DOI: https://doi.org/10.1007/s10853-013-7717-7

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