Abstract
The aim of this study was to characterize two different copper grades, oxygen-free copper, and phosphorous deoxidized copper, with aminofunctional silane layers on them and to study these silane layers as coupling agents in the injection-molded thermoplastic urethane–copper hybrids. The copper surfaces were as-received and modified, i.e., polished and oxidized. The copper surfaces and silane layers which were grown from solution concentrations of 0.25 and 0.5 vol% were studied with reflection absorption infrared spectroscopy (RAIRS), atomic force microscope (AFM), scanning electron microscope (SEM), and transmission electron microscope (TEM). The adhesive strengths of the copper–polymer joints were measured with peel tests and peeled surfaces were further studied with RAIRS, AFM, and FESEM. On the as-received copper surface, the silane layer was irregular and existed mainly in the surface roughness sites. This was the reason why hybrids manufactured with the as-received copper failed mostly in the silane layer. Hybrids manufactured with the oxidized copper sheets had a uniform silane layer and the hybrids failed mostly cohesively in thermoplastic urethane and had excellent peel strength values. In all silane-treated copper samples, Si–O–Si groups were formed confirming the cross-linking in the silane layer.
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Yun H, Cho K, An J, Park C (1992) J Mater Sci 27:5811. doi:https://doi.org/10.1007/BF01119743
Ogawa T, Nobuta J (2010) J Mater Sci 45:771. doi:https://doi.org/10.1007/s10853-009-3999-1
Plueddemann E (1982) Silane coupling agents. Plenum Press, New York
Van Schaftinghen T, Le Pen C, Terryn H, Hörzenberger F (2004) Electrochim Acta 49:2997
Petrie E (2007) Handbook of adhesives and sealants. McGraw-Hill, New York
Boerio F, Williams J, Burkstrand J (1983) J Colloid Interface Sci 91:485
Hoikkanen M, Honkanen M, Vippola M, Lepistö T, Vuorinen J (2011) Prog Org Coat (submitted)
Wetherhold R, Pisanova E, Alarifi H (2010) J Adhes Sci Technol 24:1221
Gu X, Xue G, Jiang B (1997) Appl Surf Sci 115:66
Yuan W, Van Ooij W (1997) J Colloid Interface Sci 185:197
Honkanen M, Hoikkanen M, Vippola M, Vuorinen J, Lepistö T, Jussila P, Ali-Löytty H, Valden M (2011) Appl Surf Sci (submitted)
Deflorian F, Rossi S, Fedrizzi L (2006) Electrochim Acta 51:6097
Deflorian F, Rossi S, Fedrizzi L, Fedel M (2008) Prog Org Coat 63:338
Yang J, Kolasa B, Gibson J, Yeadon M (1998) Appl Phys Lett 73:2841
Lampimäki M, Lahtonen K, Hirsimäki M, Valden M (2007) J Chem Phys 126:034703
Lahtonen K (2008) PhD thesis, Tampere University of Technology
Ghosh S, Avasthi D, Shah P, Ganesan V, Gupta A, Sarangi D, Bhattacharya R, Assmann W (2000) Vacuum 57:377
Suzuki S, Ishikawa Y, Isshiki M, Waseda Y (1997) Mater Trans JIM 38:1004
Lim J-W, Iijima J, Zhu Y, Ho Yoo J, Choi G-S, Mimura K, Isshiki M (2008) Thin Solid Films 516:4040
https://doi.org/www.luvata.com. Accessed 2 March 2011
Honkanen M, Vippola M, Lepistö T (2007) J Mater Sci 42:4684. doi:https://doi.org/10.1007/s10853-006-0351-x
Honkanen M, Vippola M, Lepistö T (2008) J Mater Res 23:1350
Honkanen M, Hoikkanen M, Vippola M, Vuorinen J, Lepistö T (2009) J Adhes Sci Technol 23:1747
Honkanen M, Hoikkanen M, Vippola M, Vuorinen J, Lepistö T (2010) In: Proceedings of 61st Annual Meeting of the Scandinavian Society for Electron Microscopy
Lefez B, Souchet R, Kartouni K, Lenglet M (1995) Thin Solid Films 268:45
Boerio F, Shah P (2005) J Adhes 81:645
Chiang C-H, Koenig J (1981) J Colloid Interface Sci 83:361
Acknowledgements
The authors thank Graduate School of Processing of Polymers and Polymer-based Multimaterials, Finnish Funding Agency for Technology and Innovation, and Finnish industry for financial support.
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Honkanen, M., Hoikkanen, M., Vippola, M. et al. Aminofunctional silane layers for improved copper–polymer interface adhesion. J Mater Sci 46, 6618–6626 (2011). https://doi.org/10.1007/s10853-011-5611-8
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DOI: https://doi.org/10.1007/s10853-011-5611-8