Abstract
This paper presents some experimental observations relative to the influence of elevated current densities on the intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints. Three samples were stressed with different current densities of 104, 1.2 × 104, and 1.4 × 104 A/cm2, respectively, for 80 h. The abnormal polarity effect of electromigration (EM) on chemical reactions at the cathode and the anode was investigated as well as the effect of EM on phase segregation in the two-phase eutectic microstructure. Results indicate that electric current enhances the growth of IMC layer at the cathode and retards it at the anode due to the Bi accumulation acting as a barrier layer with current density of 104 A/cm2. However, when current density increases, the electrical force dissolves the IMC at the cathode into the solder. More and more intermetallic precipitates formed due to the dissolution of Cu into the solder at the cathode side with increased current densities, leading to a very different morphology at the anode and the cathode interfaces, one being planar and the other being very irregular. It can be concluded that the chemical force and the electrical force are the main driving forces contributing to the IMC growth at both interfaces.
Similar content being viewed by others
References
Nah JW, Paik KW, Suh JO, Tu KN (2003) J Appl Phys 94:7560
Gan H, Tu KN (2005) J Appl Phys 97:063514-1
Lin YH, Hu YC, Tsai CM, Kao CR, Tu KN (2005) Acta Mater 53:2029
Chen S-W, Chen C-M, Liu W-C (1998) J Electron Mater 27(11):1193
Huynh QT, Liu CY, Chen C, Tu KN (2001) J Appl Phys 89(8):4332
Ou S, Tu KN (2005) In: Proceedings of the 55th ECTC, vol 2, pp 1407–1415
Liu CY, Chen C, Liao CN, Tu KN (1999) Appl Phys Lett 75(1):58
Chen C-M, Huang C-C (2007) J Alloy Compd 461:235
Chen C-M, Huang C-C (2008) J Mater Res 23(4):1051
Chen C-M, Huang C-C, Liao C-N et al (2007) J Electron Mater 36(7):760
Chen ZG (2002) J Electron Mater 31(10):1122
Chen ZG (2003). PhD Thesis, Beijing University of Technology
Xu GC, He HW, Guo F (2009) J Electron Mater 38:273
He HW, Xu GC, Hao H, Guo F (2007) ICEPT. Shanghai, China, p 225
Guo F, Xu GC, He HW (2009) J Mater Sci 44(20):5595. doi:https://doi.org/10.1007/s10853-009-3787-y
Ma HT (2009) J Mater Sci 44(14):3841. doi:https://doi.org/10.1007/s10853-009-3521-9
Cheng F, Nishikawa H, Takemoto T (2008) J Mater Sci 43(10):3643. doi:https://doi.org/10.1007/s10853-008-2580-7
Chao BH-L, Zhang X, Chae S-H, Ho PS (2009) Microelectron Reliab 49:253
Acknowledgements
The authors acknowledge the financial support of this work from the New Century Talent Support Program, Ministry of Education, and the Funding Project PHR (IHLB).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
He, H., Xu, G. & Guo, F. Electromigration-enhanced intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints. J Mater Sci 45, 929–935 (2010). https://doi.org/10.1007/s10853-009-4022-6
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10853-009-4022-6