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Effect of deposition parameters on microstructure of electrodeposited nickel thin films

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Abstract

Nickel thin films were prepared using electrodeposition process on a copper substrate. The effect of deposition parameters on film microstructure has been investigated with and without an organic additive (saccharin). Electrodeposition has been carried out using direct current electrodeposition (DCED) method and pulsed electrodeposition (PED) method. Significant reduction in crystallite size has been observed with the increase in saccharin concentration (~10 g/L) irrespective of the electrodeposition method. In PED, it has been observed that an increase in pulse width causes a drastic reduction in crystallite dimension (~15 nm) of the deposited Ni-film. Further PED process yielded needle-shaped Ni grains under controlled process conditions unlike in DCED, where spherical grain structure was observed in the micrographs. However, these needle-shaped grains change their microstructure on addition of saccharin to the bath. A phenomenological model is presented to explain the observed microstructural changes.

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References

  1. Roy I, Yang HW, Dinh L, Lund I, Earthman JC, Mohamed FA (2008) Scr Mater 59:305

    Article  CAS  Google Scholar 

  2. Palumbo G, Gonzalez F, Brennenstuhl AM, Erb U, Shmayda W, Lichtenberger PC (1997) Nanostruct Mater 9:737

    Article  CAS  Google Scholar 

  3. Osaka T (1997) Electrochim Acta 42:3015

    Article  CAS  Google Scholar 

  4. Osaka T, Sawaguchi T, Mizutani F, Yokoshima T, Takai M, Okinaka Y (1999) J Electrochem Soc 146:3295

    Article  CAS  Google Scholar 

  5. Tabakovic I, Inturi V, Riemer S (2002) J Electrochem Soc 149:C18

    Article  CAS  Google Scholar 

  6. Lallemand F, Comte D, Ricq L, Renaux P, Pagetti J, Dieppedale C, Gaud P (2004) Appl Surf Sci 225:59

    Article  CAS  Google Scholar 

  7. Gleiter H (1989) Prog Mater Sci 33:223

    Article  CAS  Google Scholar 

  8. Granqvist CG, Buhrman RA (1976) J Appl Phys 47:2200

    Article  CAS  Google Scholar 

  9. Erb U (1995) Nanostruct Mater 6:533

    Article  Google Scholar 

  10. Glasstone S (1964) An introduction to electrochemistry. Van Nostrand Inc., Princeton, NJ

    Google Scholar 

  11. Natter H, Krajewski T, Hempelmann R (1996) Ber Bunsen Phys Chem 100:55

    Article  CAS  Google Scholar 

  12. Natter H, Hempelmann R (1996) J Phys Chem 100:19525

    Article  CAS  Google Scholar 

  13. O’Reilly C, Sanvito S, Rhen FMF, Stamenov P, Coey JMD (2006) J Appl Phys 99:08J301

    Article  Google Scholar 

  14. Karayianni HS, Patermarakis GS, Papaioannou JC (2002) Mater Lett 53:91

    Article  CAS  Google Scholar 

  15. Zhao H, Liu L, Zhu J, Tang Y, Hu W (2007) Mater Lett 61:1605

    Article  CAS  Google Scholar 

  16. Tang Y, Zhao D, Shen D, Zhang J, Li B, Lu Y, Fan X (2008) Thin Solid Films 516:2094

    Article  CAS  Google Scholar 

  17. Motoyama M, Fukunaka Y, Sakka T, Ogatab YH (2006) J Electrochem Soc 153:C502

    Article  CAS  Google Scholar 

  18. Li Y, Jiang H, Pang L, Wang B, Liang X (2007) Surf Coat Technol 201:5925

    Article  CAS  Google Scholar 

  19. Ebrahimi F, Ahmed Z (2003) J Appl Electrochem 33:733

    Article  CAS  Google Scholar 

  20. Ganesh V, Vijayaraghavan D, Lakshminarayanan V (2005) Appl Surf Sci 240:286

    Article  CAS  Google Scholar 

  21. Qu NS, Zhu D, Chan KC, Lei WN (2003) Surf Coat Technol 168:123

    Article  CAS  Google Scholar 

  22. Natter H, Schmelzer M, Hempelmann R (1998) J Mater Res 13:1186

    Article  CAS  Google Scholar 

  23. Gamburg YD, Grosheva MY, Biallozor S, Hass M (2002) Surf Coat Technol 150:95

    Article  CAS  Google Scholar 

  24. Oniciu L, Muresan L (1991) J Appl Electrochem 21:565

    Article  CAS  Google Scholar 

  25. Galvani F, Carlos IA (1997) Metal Finish 95:70

    Article  CAS  Google Scholar 

  26. Carlos IA, Malaquias MA, Oizumi MM, Matsuo TT (2001) J Power Sources 92:56

    Article  CAS  Google Scholar 

  27. Almeida MRH, Carlos IA, Barbosa LL, Carlos RM, Lima-Neto BS, Pallone EMJA (2002) J Appl Electrochem 32:763

    Article  Google Scholar 

  28. Carlos IA, Siqueira JL, Finazzi GA, Almeida MRH (2003) J Power Sources 117:179

    Article  CAS  Google Scholar 

  29. Carlos IA, Almeida MRH (2004) J Electroanal Chem 562:153

    Article  CAS  Google Scholar 

  30. Finazzi GA, Oliveira EM, Carlos IA (2004) Surf Coat Technol 187:377

    Article  CAS  Google Scholar 

  31. Barbosa LL, Almeida MRH, Carlos RM, Yonashiro M, Oliveira GM, Carlos IA (2005) Surf Coat Technol 192:145

    Article  CAS  Google Scholar 

  32. Darrort V, Troyon M, Ebotht J, Bissieux C, Nicollin C (1995) Thin Solid Films 265:52

    Article  CAS  Google Scholar 

  33. Mohamed FA, Chauhan M (2006) Metall Mater Trans A 37A:3555

    Article  CAS  Google Scholar 

  34. El-Sherik AM, Shirokoff J, Erb U (2005) J Alloys Compd 389:140

    Article  CAS  Google Scholar 

  35. Cullity BD (1978) Elements of X-ray diffraction, 2nd edn. Addison-Wesley, Reading, MA

    Google Scholar 

  36. Chauhan M, Mohamed FA (2007) J Mater Sci 42:1606. doi:https://doi.org/10.1007/s10853-006-0823-z

    Article  CAS  Google Scholar 

  37. Ares JR, Pascual A, Ferrer IJ, Sanchez C (2005) Thin Solid Films 480–481:477

    Article  Google Scholar 

  38. Dini JW (1996) Electrodeposition, the materials science of coatings and substrates. Noyes Publications, Norwich

    Google Scholar 

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Acknowledgements

Amaresh Chandra Mishra would like to thank Council of scientific and Industrial Research (CSIR) for providing financial assistance for carrying out this study. This study was partially supported by the Defence Research Development Organization (DRDO), New Delhi, India.

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Authors and Affiliations

  1. Department of Physics & Meteorology, Indian Institute of Technology, Kharagpur, 721302, India

    Amaresh Chandra Mishra, Awalendra K. Thakur & V. Srinivas

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  1. Amaresh Chandra Mishra
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  2. Awalendra K. Thakur
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  3. V. Srinivas
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Correspondence to Awalendra K. Thakur.

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Mishra, A.C., Thakur, A.K. & Srinivas, V. Effect of deposition parameters on microstructure of electrodeposited nickel thin films. J Mater Sci 44, 3520–3527 (2009). https://doi.org/10.1007/s10853-009-3475-y

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  • DOI: https://doi.org/10.1007/s10853-009-3475-y

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