Abstract
Diagnostic criteria were developed to elucidate the reduction mechanism of an oxidant on a copper (Cu) surface at the corrosion potential. The corrosion potential of Cu tu was measured for various pH and iodate (IO −3 ) concentrations using the rotating disk electrode technique. According to the measured corrosion potentials, IO −3 was an effective CMP oxidant only below pH Application of the diagnostic criteria on the Cu – IO −3 system showed that the reduction of IO −3 on Cu was under the mixed kinetic and diffusion control at the corrosion potentia l below pH 3. Above pH 3, however, the anodic process dominated over the cathodic process.
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Anik, M. Selection of an oxidant for copper chemical mechanical polishing: Copper-iodate system. J Appl Electrochem 35, 1–7 (2005). https://doi.org/10.1007/s10800-004-1763-4
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DOI: https://doi.org/10.1007/s10800-004-1763-4