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A simple approach to fabricate multi-layer glass microfluidic chips based on laser processing and thermocompression bonding

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Abstract

Glass is an ideal material for microfluidic chips because of its pressure resistance, chemical stability, optical transparency, and thermal stability. Two-layer or three-layer microfluidic glass chips, composed of one or two cover layers and one structural layer, have been widely applied to two-dimensional microfluidic systems. Due to the fabrication difficulties in aligning and bonding multiple glass layers, multi-layer glass chips (more than three layers) are underutilized, although they are essential to deliver more complicated microfluidic functionalities and achieve more accurate microfluidic manipulations. This work proposes a fabrication process based on rapid laser cutting of single glass layers and one-time thermocompression bonding of multi-layer chips and demonstrated it with a five-layer microfluidic chip for three-dimensional (3D) hydrodynamic focusing. The pressure and temperature are the key parameters for multi-layer bonding, which are experimentally determined to be 0.4 MPa and 605 ℃. Five-layer glass microfluidic chips could be fabricated within 6 h with a bonding strength of 0.6 MPa. This simple, easy-to-operate fabrication method for the rapid production of multi-layer glass microfluidic chips will be conducive to the wide application of multi-layer microfluidic glass chips.

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Acknowledgements

This work was supported by the fund for the Joint Project of Beijing (Beijing Municipal Commission of Education) and the National Natural Science of China (Grant Number: 61727813). The authors acknowledge Dr. XingZhe Yu from the School of Aerospace Engineering, Tsinghua University for his help in the bonding strength experiments.

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Correspondence to Jingjing Zhao or Zheng You.

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Han, Y., Jiao, Z., Zhao, J. et al. A simple approach to fabricate multi-layer glass microfluidic chips based on laser processing and thermocompression bonding. Microfluid Nanofluid 25, 77 (2021). https://doi.org/10.1007/s10404-021-02479-y

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  • DOI: https://doi.org/10.1007/s10404-021-02479-y

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