Abstract
The mechanical behavior of a novel resonant microstructure for magnetic applications through analytical and finite element (FE) models is presented. The squeeze-film damping is included with the development of a theoretical model which considers the parallel and transversal beams of the resonant structure. The response of the microstructure is obtained considering various magnetic fields orientations, and AC excitation currents with different magnitudes and frequencies. The microstructure has thin beam elements of polysilicon, 1.5 μm thickness by 20 μm width. It is suspended by air-gap of 2.5 μm and operates in the first torsional mode taking advantage of the Lorentz force principle. The analytical and FE results indicate a linear behavior of the microstructure deflection with a low consumption of AC current (574 μA) caused for 2 V AC voltage. Optimum response obtained using the mathematical analysis was 530 nm/Tesla with the magnetic field parallel to the microstructure (θ = 90° and α = 0°). These results show good agreement with the FE models.
Similar content being viewed by others
References
Ciudad D, Aroca C, Sánchez M, Lopez E, Sánchez P (2004) Modeling and fabrication of a MEMS magnetostatic magnetic sensor. J Sens Actuators A 115:408–416
Corman T, Enoksson P, Stemme G (1997) Gas damping of electrostatically excited resonators. J Sens Actuators A 61:249–255
Gad-el-Hak M (2001) The MEMS handbook. CRC Press, Boca Raton
Hsu TR (2002) Mems & microsystems design and manufacture. McGraw-Hill, Boston
Judy JW, Muller RS (1997) Magnetically actuated, addressable microstructure. J Microelectromech Syst 6:249–256
Kadár Z, Kindt W, Bossche A, Mollinger J (1996) Quality factor of torsional resonators in the low-pressure region. J. Sens Actuators A 53:299–303
Lenz J (1990) Review of magnetic sensors. Proc IEEE 78:973–989
Mohite SS, Kesari H, Sonti VR, Pratap R (2005) Analytical solutions for the stiffness and damping coefficients of squeeze films in MEMS devices with perforated back plates. J Micromech Microeng 15:2083–2092
Randjelovic ZB, Kayal M, Popovic R, Blanchard H (2002) Highly sensitive hall magnetic sensor microsystem in CMOS technology. IEEE J Solid State Circuits 37:151–159
Rao SS (2004) Mechanical vibrations. Pearson Prentice Hall, New Jersey
Ripka P (2001) Magnetic sensors and magnetometers. Artech House Inc, Boston
Stemme E, Stemme G (1992) A capacitively excited and detected resonant pressure sensor with temperature compensation. J Sens Actuators A 32:639–647
Tucker J, Wesoleck D, Wickenden D (2002) An integrated CMOS MEMS xylophone magnetometer with capacitive sense electronics. NanoTech 2002, Houston, Texas, pp 1–5
Yang YJ, Senturia SD (1996) Numerical simulation of compressible squeezed-film damping. IEEE solid-state sensors actuator workshop, Hilton Head Island, SC, p 76
Yang HH, Myung NV, Yee J, Park DY, Yoo BY, Schwartz M, Nobe K, Judy JW (2002) Ferromagnetic micromechanical magnetometer. J Sens Actuators A 97–98:88–97
Yee JK, Yang HH, Judy JW (2003) Shock resistance of ferromagnetic micromechanical magnetometers. J Sens Actuators A 103:242–252
Acknowledgments
The authors are very grateful to Ignacio Juarez Ramirez of INAOE and Professor Jerry Hemmye of Western Michigan University for their help in this work.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Herrera-May, A.L., Aguilera-Cortés, L.A., García-Gonzalez, L. et al. Mechanical behavior of a novel resonant microstructure for magnetic applications considering the squeeze-film damping. Microsyst Technol 15, 259–268 (2009). https://doi.org/10.1007/s00542-008-0658-4
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00542-008-0658-4