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Investigations of development process of high hollow beveled microneedles using a combination of ICP RIE and dicing saw

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Abstract

Micromachined needles provide a promising technology for painless delivery of molecules or foreign substance into a living cell. Over the recent years, a variety of different microneedle shapes and materials have been studied and have shown their facility to disrupt stratum corneum layer to increase the skin permeability. In this paper, we described an alternative process to fabricate high and beveled hollow out-of-plane microneedles. Silicon microneedles dimensions are 40–60 μm in inner diameter, 150–200 μm in outer diameter and over 700 μm in height. Tip angles reached are from 30° to 45°.

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Acknowledgments

This work is supported by the FP6 European project ANGIOSKIN (project number: LSH-2003-521127).

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Authors and Affiliations

  1. Department LPMO, Institut FEMTO-ST, 32 rue de l’Observatoire, Besançon, France

    N. Baron, J. Passave, B. Guichardaz & G. Cabodevila

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  1. N. Baron
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  2. J. Passave
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  3. B. Guichardaz
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  4. G. Cabodevila
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Correspondence to N. Baron.

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Baron, N., Passave, J., Guichardaz, B. et al. Investigations of development process of high hollow beveled microneedles using a combination of ICP RIE and dicing saw. Microsyst Technol 14, 1475–1480 (2008). https://doi.org/10.1007/s00542-008-0596-1

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  • DOI: https://doi.org/10.1007/s00542-008-0596-1

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