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Crack propagation in a functionally graded plate under thermal shock

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Summary

Thermal cracking in a ceramic/metal functionally graded plate is discussed. When a functionally graded plate is cooled from high temperature, curved or straight crack paths are experimentally observed on the ceramic surface. One of the reasons that make the crack paths to differ are the thermal or mechanical conditions. In order to clarify the influence of these conditions on the crack path, the crack propagation is simulated using finite element method.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Faculty of Engineering, Shizuoka University, Hamamatsu, Shizuoka, 432-8561, Japan, , , , , , JP

    T. Fujimoto & N. Noda

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  1. T. Fujimoto
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  2. N. Noda
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Additional information

Received 29 September 1998; accepted for publication 2 August 1999

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Fujimoto, T., Noda, N. Crack propagation in a functionally graded plate under thermal shock. Archive of Applied Mechanics 70, 377–386 (2000). https://doi.org/10.1007/s004199900069

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  • DOI: https://doi.org/10.1007/s004199900069

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