Abstract
In this paper, multilayer TiN/W with interfacial nanostructure is used as electrode for application in low-power phase change memory (PCM). Compared with single-layer electrode, multilayer electrode has much lower thermal conductive due to the interfacial scattering effect. PCM based on multilayer electrode with different thickness ratio of TiN and W was fabricated and characterized. The device properties including operation voltage and endurance depended critically on the multilayer structure rather than the thickness ratio of TiN and W. The low operation voltage and long cycle life of multilayer-electrode-based PCM result from the increase in overall thermal resistance due to the low thermal conductivity of multilayer electrode.
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M. Wuttig, N. Yamada, Nat. Mater. 6, 824 (2007)
F. Pan, C. Chen, Z.-S. Wang, Y.-C. Yang, J. Yang, F. Zeng, Progr. Nat. Sci. Mater. Int. 20, 1 (2010)
J. Junquera, P. Ghosez, Nature 422, 506 (2003)
J.-M. Hu, Z. Li, L.-Q. Chen, C.-W. Nan, Nat. Commun. 2, 553 (2011)
A.L. Lacaita, A. Redaelli, Microelectron. Eng. 109, 351 (2013)
R. Jeyasingh, L. Jiale, M. A. Caldwell, D. Kuzum, and H. S. P. Wong, in Phase Change Memory: Scaling and applications. Custom Integrated Circuits Conference (CICC) (IEEE, San Jose, California, USA, 2012), p. 1
R. Bez, S. Bossi, B. Gleixner, F. Pellizzer, A. Pirovano, G. Servalli, and M. Tosi, in Phase Change Memory development trends. Memory Workshop (IMW) (IEEE International, Seoul, Korea, 2010), p. 1
Y. Sung-Min, L. Nam-Yeal, R. Sang-Ouk, C. Kyu-Jeong, Y.S. Park, L. Seung-Yun, Y. Byoung-Gon, K. Myung-Jin, C. Se-Young, M. Wuttig, IEEE Electron Device Lett. 27, 445 (2006)
T.C. Chong, Appl. Phys. Lett. 88, 122114 (2006)
Y. Hu, X. Feng, S. Li, T. Lai, S. Song, Z. Song, J. Zhai, Appl. Phys. Lett. 103, 152107 (2013)
T.-Y. Lee, K.H.P. Kim, D.-S. Suh, C. Kim, Y.-S. Kang, D.G. Cahill, D. Lee, M.-H. Lee, M.-H. Kwon, K.-B. Kim, Y. Khang, Appl. Phys. Lett. 94, 243103 (2009)
Y. H. Ha, J. H. Yi, H. Horii, J. H. Park, S. H. Joo, S. O. Park, U. I. Chung, and J. T. Moon, in An edge Contact Type Cell for Phase Change RAM Featuring Very Low Power Consumption. Symposium on VLSI Technology. Digest of Technical Papers. (IEEE, Kyoto, Japan, 2003), p. 175
W. S. Chen, C. Lee, D. S. Chao, Y. C. Chen, F. Chen, C. W. Chen, R. Yen, M. J. Chen, W. H. Wang, T. C. Hsiao, J. T. Yeh, S. H. Chiou, M. Y. Liu, T. C. Wang, L. L. Chein, C. Huang, N. T. Shih, L. S. Tu, D. Huang, T. H. Yu, M. J. Kao, and M. Tsai, in A Novel Cross-Spacer Phase Change Memory with Ultra-Small Lithography Independent Contact Area. Electron Devices Meeting, IEDM (IEEE International, Washington, DC, 2007), p. 319
M. Breitwisch, T. Nirschl, C. F. Chen, Y. Zhu, M. H. Lee, M. Lamorey, G. W. Burr, E. Joseph, A. Schrott, J. B. Philipp, R. Cheek, T. D. Happ, S. H. Chen, S. Zaidi, P. Flaitz, J. Bruley, R. Dasaka, B. Rajendran, S. Rossnage, M. Yang, Y. C. Chen, R. Bergmann, H. L. Lung, and C. Lam, in Novel Lithography-Independent Pore Phase Change Memory. IEEE Symposium on VLSI Technology (IEEE, Kyoto, Japan, 2007), p. 100
F. Xiong, M.-H. Bae, Y. Dai, A.D. Liao, A. Behnam, E.A. Carrion, S. Hong, D. Ielmini, E. Pop, Nano Lett. 13, 464 (2012)
W.I. Park, B.K. You, B.H. Mun, H.K. Seo, J.Y. Lee, S. Hosaka, Y. Yin, C.A. Ross, K.J. Lee, Y.S. Jung, ACS Nano 7, 2651 (2013)
Y. Lu, S. Song, Z. Song, L. Wu, A. He, Y. Gong, F. Rao, B. Liu, Appl. Phys. Lett. 101, 113104 (2012)
J. Y. Wu, M. Breitwisch, S. Kim, T. H. Hsu, R. Cheek, P. Y. Du, J. Li, E. K. Lai, Y. Zhu, T. Y. Wang, H. Y. Cheng, A. Schrott, E. A. Joseph, R. Dasaka, S. Raoux, M. H. Lee, H. L. Lung, and C. Lam, in A Low Power Phase Change Memory Using Thermally Confined TaN/TiN Bottom Electrode, 2011, p. 3.2.1
D. Loke, L. Shi, W. Wang, R. Zhao, L.-T. Ng, K.-G. Lim, H. Yang, T.-C. Chong, Y.-C. Yeo, Appl. Phys. Lett. 97, 243508 (2010)
K.F. Kao, C.M. Lee, M.J. Chen, M.J. Tsai, T.S. Chin, Adv. Mater. 21, 1695 (2009)
Y. Lu, S. Song, Z. Song, W. Ren, Y. Cheng, B. Liu, Appl. Phys. Express 4, 094102 (2011)
W. Lee, M. Siddik, S. Jung, J. Park, S. Kim, J. Shin, J. Lee, S. Park, M. Son, H. Hwang, IEEE Electron Device Lett. 32, 1573 (2011)
K. Nitta, T. Nohira, R. Hagiwara, M. Majima, S. Inazawa, J. Appl. Electrochem. 40, 1443 (2010)
G. Chen, Phys. Rev. B 57, 14958 (1998)
X.Y. Yu, G. Chen, A. Verma, J.S. Smith, Appl. Phys. Lett. 67, 3554 (1995)
G. Chen, M. Neagu, Appl. Phys. Lett. 71, 2761 (1997)
U. Russo, D. Ielmini, A. Redaelli, A.L. Lacaita, IEEE Trans. Electron Devices 55, 506 (2008)
H. Zhu, J. Yin, Y. Xia, Z. Liu, Appl. Phys. Lett. 97, 083504 (2010)
C. Kim, D. Kang, T.-Y. Lee, K.H.P. Kim, Y.-S. Kang, J. Lee, S.-W. Nam, K.-B. Kim, Y. Khang, Appl. Phys. Lett. 94, 193504 (2009)
L. van Pieterson, M.H.R. Lankhorst, M. van Schijndel, A.E.T. Kuiper, J.H.J. Roosen, J. Appl. Phys. 97, 083520 (2005)
A. Pirovano, A. L. Lacaita, A. Benvenuti, F. Pellizzer, S. Hudgens, and R. Bez, in Scaling Analysis of Phase-Change Memory Technology, 2003 (Electron Devices Meeting, 2003), p. 699
Acknowledgments
This work is supported by National Science Foundation of China (Grant Nos. 61306147, 61377061) and sponsored by K. C. Wong Magna Fund in Ningbo University.
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Lu, Y., Song, S., Shen, X. et al. Low-power phase change memory with multilayer TiN/W nanostructure electrode. Appl. Phys. A 117, 1933–1940 (2014). https://doi.org/10.1007/s00339-014-8660-4
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DOI: https://doi.org/10.1007/s00339-014-8660-4