Skip to main content
SpringerLink
Log in

Development of low-cost hot embossing stamps with long life span and environmental protection

  • ORIGINAL ARTICLE
  • Published:
The International Journal of Advanced Manufacturing Technology Aims and scope Submit manuscript

Abstract

Time, cost, and life span are three major concerns that are needed to manufacture a new hot embossing stamp in the industry. The aim of this study is to develop a rapid and low-cost method for fabricating new hot embossing stamps with a long life span. Based on the results of ANSYS simulations, the maximum stresses can be reduced when the round and chamfer were applied at the junction of groove and sprue in the backing plate. Experimental results found that the fracture locations were found to be in reasonable agreement with the simulation results using ANSYS software. The hot embossing stamp can be used for batch production and evaluation in the research and development stage of a new optical element when the junction of groove and sprue in the backing plate were rounded with a radius more than 2 mm or chamfered with a width more than 3 mm.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Gope PC, Singh VK (2011) Effect of filler addition and strain rate on the compressive strength of silica styrene-butadiene rubber-filled epoxy composites. Polym Eng Sci 51(6):1130–1136

    Article  Google Scholar 

  2. Wetzel B, Haupert F, Friedrich K, Zhang MQ, Rong MZ (2002) Impact and wear resistance of polymer nanocomposites at low filler content. Polym Eng Sci 42(9):1919–1927

    Article  Google Scholar 

  3. Fu J, Shi L, Zhang D, Zhong Q, Chen Y (2010) Effect of nanoparticles on the performance of thermally conductive epoxy adhesives. Polym Eng Sci 50(9):1809–1819

    Article  Google Scholar 

  4. Burmistrov IN, Shatrova NV, Mostovoy AS, Mazov IN, Kuznetsov DV, Panova LG, Gorokhovsky AV, Yudin AG (2014) Mechanical properties of (surface-modified potassium polytitanate small additives)/epoxy composite materials. Polym Eng Sci 54(12):2866–2871

    Article  Google Scholar 

  5. Rahmati S (2014) 10.12–direct rapid tooling. Comprehensive Materials Processing 10:303–344

    Article  Google Scholar 

  6. Kuo CC, Shiu SR (2013) A cost-effective method to fabricate micro mold for microstructures replication using rapid tooling. Mater Werkst 28(11):927–932

    Article  Google Scholar 

  7. Kuo CC, Wang YJ (2014) Development of a micro-hot embossing mold with high replication fidelity using surface modification. Mater Manuf Process 29(9):1101–1110

    Article  Google Scholar 

  8. Kamara AM, Marimuthu S, Li L (2014) Finite element modeling of microstructure in laser-deposited multiple layer Inconel 718 parts. Mater Manuf Process 29(10):1245–1252

    Article  Google Scholar 

  9. Kalyan C, Samuel GL (2015) Cutting mode analysis in high speed finish turning of AlMgSi alloy using edge chamfered PCD tools. J Mater Process Technol 2169:146–159

    Article  Google Scholar 

  10. Kurt A, Şeker U (2005) The effect of chamfer angle of polycrystalline cubic boron nitride cutting tool on the cutting forces and the tool stresses in finishing hard turning of AISI 52100 steel. Mater Des 26(4):351–356

    Article  Google Scholar 

  11. Koerner T, Brown L, Xie R, Oleschuk RD (2005) Epoxy resins as stamps for hot embossing of microstructures and microfluidic channels. Sensors Actuators B Chem 107:632–639

    Article  Google Scholar 

  12. Saha B, Tor SB, Liu E, Hardt DE, Chun JH (2011) Hot-embossing performance of silicon micromold coated with self-assembled n-octadecyltrichlorosilane. Sensors Actuators B Chem 160:207–214

    Article  Google Scholar 

  13. Wang C, Cho SJ, Kim NY (2013) SU-8-based structural material for microelectronic processing applications. Mater Manuf Process 28:947–952

    Google Scholar 

  14. Habib S, Okada A (2016) Experimental investigation on wire vibration during fine wire electrical discharge machining process. Int J Adv Manuf Technol 84(9):2265–2276

    Article  Google Scholar 

  15. Bhavsar SN, Aravindan S, Rao PV (2012) Machinability study of cemented carbide using focused ion beam (FIB) milling. Mater Manuf Process 27:1029–1034

    Article  Google Scholar 

  16. Malapati M, Bhattacharyya B (2011) Investigation into electrochemical micromachining process during micro-channel generation. Mater Manuf Process 26:1019–1027

    Article  Google Scholar 

  17. Yung KC, Wang J, Huang SQ, Lee CP, Yue TM (2006) Modeling the etching rate and uniformity of plasma-aided manufacturing using statistical experimental design. Mater Manuf Process 21:899–906

    Article  Google Scholar 

  18. Amini S, Paktinat H, Barani A, Tehran AF (2013) Vibration drilling of Al2024-T6. Mater Manuf Process 28:476–480

    Article  Google Scholar 

  19. Meena VK, Azad MS (2012) Grey relational analysis of micro-EDM machining of Ti-6Al-4 V alloy. Mater Manuf Process 27:973–977

    Article  Google Scholar 

  20. Uppal N, Shiakolas PS, Priya S (2005) Micromachining of PZT using ultrafast femtosecond laser. Mater Manuf Process 32:67–77

    Google Scholar 

  21. Zhong J-M, Wu X-Y, Xu B, Li J-B, Luo F, Cheng R, Ruan S-C (2015) Laminated fabrication of micro-stepped gear mold based on WEDM and thermal diffusion welding. Int J Adv Manuf Technol 78(5):1233–1240

    Article  Google Scholar 

  22. Charee W, Tangwarodomnukun V, Dumkum C (2015) Laser ablation of silicon in water under different flow rates. Int J Adv Manuf Technol 78(1):19–29

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Department of Mechanical Engineering, Ming Chi University of Technology, No. 84, Gungjuan Road, New Taipei City, 243, Taiwan

    Chil-Chyuan Kuo & Shin-Yun Lyu

Authors
  1. Chil-Chyuan Kuo
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Shin-Yun Lyu
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Chil-Chyuan Kuo.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Kuo, CC., Lyu, SY. Development of low-cost hot embossing stamps with long life span and environmental protection. Int J Adv Manuf Technol 91, 1889–1895 (2017). https://doi.org/10.1007/s00170-016-9953-x

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00170-016-9953-x

Keywords

Search

Navigation