Skip to main content
SpringerLink
Log in

Subsurface damage depth and distribution in rotary ultrasonic machining and conventional grinding of glass BK7

  • ORIGINAL ARTICLE
  • Published:
The International Journal of Advanced Manufacturing Technology Aims and scope Submit manuscript

Abstract

The morphology, depth, and distribution of subsurface damage (SSD) on glass BK7 specimens produced in rotary ultrasonic machining (RUM) and conventional grinding (CG) processes with three diamond tools were investigated. The ultrasonic effects on the SSD characteristics were also explored with respect to the material removal mechanisms and the specific kinematics principles of the abrasives. The experimental results demonstrated that the increased cutting velocity would improve the subsurface qualities, while the increased feed speed and cutting depth would deteriorate SSD depth of the RUM/CG specimens. Superimposition with the ultrasonic vibration increased the maximum cutting depth of each abrasive by an amplitude and also resulted in the cyclical variation in abrasive trajectories, hereby worsening the SSD depth of the final RUM surfaces. A large amount of incipient cracks which pulverized the material were just concentrated on the top RUM surface, thus increasing the subsurface crack distributions. With the abrasive moving ahead, these incipient cracks would propagate forward, hereby hindering the nucleation of the fresh cracks, and decreasing the subsurface crack obscurations of the RUM surface at a local level. Some rogue cracks were occasionally found to be located in deeper subsurface of the RUM/CG specimens, and the mutual interactions between the adjacent abrasive indentations would promote the propagations of the subsurface cracks, which gave rise to the nucleation of these rogue cracks.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. P.P Hed, D.F. Edwards, Relationship between subsurface damage depth and surface roughness during grinding of optical glass with diamond tools, Appl. Opt. 26 (1987) 2491

  2. Li S, Wang Z, Wu Y (2008) Relationship between subsurface damage and surface roughness of optical materials in grinding and lapping processes. J Mater Process Tech 205:34–41

    Article  MathSciNet  Google Scholar 

  3. Wang J, Li Y (2011) Evaluating subsurface damage in optical glasses. J Eur Opt Soc-Rapid 6:11001

    Google Scholar 

  4. Helbawi H, Zhang L, Zarudi I (2001) Difference in subsurface damage in indented specimens with and without bonding layer. Int J Mech Sci 43:1107–1121

    Article  Google Scholar 

  5. Lv D, Huang Y, Tang Y, Wang H (2013) Relationship between subsurface damage and surface roughness of glass BK7 in rotary ultrasonic machining and conventional grinding processes. Int J Adv Manuf Technol 67:613–622

    Article  Google Scholar 

  6. Randi JA, Lambropoulos JC, Jacobs SD (2005) Subsurface damage in some single crystalline optical materials. Appl Opt 44:2241–2249

    Article  Google Scholar 

  7. Miller PE, Suratwala TI, Wong LL, Feit MD, Menapace JA, Davis PJ, Steele RA (2005) The distribution of subsurface damage in fused silica. Proc SPIE 5991:1–25

    Article  Google Scholar 

  8. Yoshikawa M, Zhang B, Tokura H (1987) Observations of ceramics surface cracks by newly proposed methods. J Ceram Soc Jpn 95:961–969 (in Japanese)

    Google Scholar 

  9. Wong L, Suratwala T, Feit MD, Miller PE, Steele R (2009) The effect of HF/NH4F etching on the morphology of surface fractures on fused silica. J Non-Crystal Solids 355:797–810

    Article  Google Scholar 

  10. Liao ZM, Cohen SJ, Taylor JR (1995) Total internal reflection microscopy (TIRM) as a nondestructive subsurface damage assessment tool. Proc SPIE 2428:43–53

    Article  Google Scholar 

  11. Winn J, Yeomans JA (1996) A study of microhardness indentation fracture in alumina using confocal scanning laser microscopy. Philos Mag A 74:1253–1263

    Article  Google Scholar 

  12. Wuttig A, Steinert J, Duparre A, Truckenbrodt H (1999) Surface roughness and subsurface damage characterization of fused silica substrates. Proc SPIE 3739:369–376

    Article  Google Scholar 

  13. Li Y, Huang H, Xie R, Li H, Deng Y, Chen X, Wang J, Xu Q, Yang W, Guo Y (2010) A method for evaluating subsurface damage in optical glass. Opt Express 18:17180–17186

    Article  Google Scholar 

  14. Suratwala T, Wong L, Miller P, Feit MD, Menapace J, Steele R, Davis P, Walmer D (2006) Sub-surface mechanical damage distributions during grinding of fused silica. J Non-Cryst Solids 352:5601–5617

    Article  Google Scholar 

  15. Wang Z, Wu Y, Dai Y, Li S (2008) Subsurface damage distribution in the lapping process. Appl Opt 47:1417–1426

    Article  Google Scholar 

  16. Lv D, Wang H, Tang Y, Huang Y, Zhang H, Ren W (2012) Surface observations and material removal mechanisms in rotary ultrasonic machining of brittle material. Proc IMechE Part B: J Eng Manu 226:1479–1488

    Article  Google Scholar 

  17. Qu W, Wang K, Miller MH, Huang Y, Chandra A (2000) Using vibration-assisted grinding to reduce subsurface damage. Precis Eng 24:329–337

    Article  Google Scholar 

  18. Li Y, Zheng N, Li H, Hou J, Lei X, Chen X, Yuan Z, Guo Z, Wang J, Guo Y, Xu Q (2011) Morphology and distribution of subsurface damage in optical fused silica parts: Bound-abrasive grinding. Appl Surf Sci 257:2066–2073

    Article  Google Scholar 

  19. M. Buijs, K,K. Houten, Three-body abrasion of brittle materials as studied by lapping, Wear 166 (1993) 237–245

  20. Suratwala T, Steele R, Feit MD, Wong L, Miller P, Menapace J, Davis P (2008) Effect of rogue particles on the sub-surface damage of fused silica during grinding polishing. J Non-Cryst Solids 354:2023–2037

    Article  Google Scholar 

  21. Zhou X, Xi F (2002) Modeling and predicting surface roughness of the grinding process. Int J Mach Tool Manu 42:969–977

    Article  Google Scholar 

  22. Malkin S, Hwang TW (1996) Grinding mechanisms for ceramics. Ann CIRP 45:569–580

    Article  Google Scholar 

  23. Buijs M, Martens LAAG (1992) Effect of indentation interaction on cracking. J Am Ceram Soc 75:2809–2814

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Institute of Advanced Manufacturing Technology, Ningbo Institute of Material Technology and Engineering, Chinese Academy of Sciences, Zhongguan West Road 1219#, Ningbo, 315201, People’s Republic of China

    Dongxi Lv & Wenwu Zhang

  2. School of Mechanical and Electrical Engineering, Harbin Institute of Technology, Harbin, 150001, People’s Republic of China

    Hongxiang Wang

  3. Institute of Oceanographic Instrumentation, Shandong Academy of Sciences, Qingdao, 266001, People’s Republic of China

    Ziqiang Yin

Authors
  1. Dongxi Lv
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Hongxiang Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Wenwu Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Ziqiang Yin
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Dongxi Lv.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Lv, D., Wang, H., Zhang, W. et al. Subsurface damage depth and distribution in rotary ultrasonic machining and conventional grinding of glass BK7. Int J Adv Manuf Technol 86, 2361–2371 (2016). https://doi.org/10.1007/s00170-016-8376-z

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00170-016-8376-z

Keywords

Search

Navigation