An experimental study on microcutting of silicon using a micromilling machine

Abstract

Micro-end-milling can potentially create desired 3D free-form surface features on silicon using ductile machining technology. A number of technological barriers must be overcome for micro-end-milling to be applied in the cutting of single crystal silicon. To produce smooth surfaces on brittle materials, such as silicon, it is important that the material be machined in the ductile mode. A major limitation of machining brittle materials is that the process of removing the material can generate subsurface damage. We have carried out an experimental study to find the optimum cutting conditions for obtaining ductile regime machining using a micromilling machine. The ductile and brittle regimes in the machining of silicon using diamond-coated end mills were demonstrated by machining grooves. The force ratio, F_t/F_c, was used to determine the milling performance on silicon. The experimental data show that the dominant ductile cutting mode was achieved when F_t/F_c > 1.0.