Abstract
Due to its extremely low fracture toughness of brittle materials, it is difficult to obtain deep micro-structures on brittle materials with ultra-smooth surface quality using previous ductile machining models based on plunge cutting, diamond milling, and grinding. Current methods to enhance the machinability of silicon include laser-assisted machining, ion implantation modification, and vibration-assisted machining. However, the increase of the ductile machining depth using these methods is still very small in the fabrication of deep micro-structures with a depth over tens of micrometers on silicon. This chapter proposes a novel ductile machining model for ultra-precision fly cutting (UPFC) to efficiently fabricate deep micro-structures on brittle materials. The modeling results show that through configuring a large swing radius, much deeper ductile machining depth can be reached by UPFC. To confirm this proposed model, micro-grooves with different depths were machined, and the surface micro-topographies, form error, tool wear patterns, and material phase transformation were analyzed and compared with that acquired by diamond sculpturing method. The experimental results demonstrated that much deeper micro-grooves (over tens of micrometers) with better surface quality were acquired by UPFC. Moreover, compared with the sculpturing method, UPFC prolonged the tool life and generated less amorphous silicon on the machined surface.
References
Arif M, Rahman M, San WY (2012) An experimental investigation into micro ball end-milling of silicon. J Manuf Process 14:52–61
Blake PN, Scattergood RO (1990) Ductile-regime machining of Germanium and silicon. J Am Ceram Soc 73:949–957
Chen Y-L, Cai Y, Shimizu Y, Ito S, Gao W, Ju B-F (2015) Ductile cutting of silicon microstructures with surface inclination measurement and compensation by using a force sensor integrated single point diamond tool. J Micromech Microeng 26:025002
Dumstorff G, Pille C, Tiedemann R, Busse M, Lang W (2017) Smart aluminum components: printed sensors for integration into aluminum during high-pressure casting. J Manuf Process 26:166–172
Goel S, Luo X, Agrawal A, Reuben RL (2015) Diamond machining of silicon: a review of advances in molecular dynamics simulation. Int J Mach Tools Manuf 88:131–164
Harvey JE, Schröder S, Choi N, Duparré A (2012a) Total integrated scatter from surfaces with arbitrary roughness, correlation widths, and incident angles. Opt Eng 51:013402-013401–013402-013411
Harvey JE, Choi N, Schroeder S, Duparré A (2012b) Total integrated scatter from surfaces with arbitrary roughness, correlation widths, and incident angles. Opt Eng 51:013402
John S (2012) Why trap light? Nat Mater 11:997
Koch K, Ensikat H-J (2008) The hydrophobic coatings of plant surfaces: epicuticular wax crystals and their morphologies, crystallinity and molecular self-assembly. Micron 39:759–772
Komiya R, Kimura T, Nomura T, Kubo M, Yan J (2018) Ultraprecision cutting of single-crystal calcium fluoride for fabricating micro flow cells. J Adv Mech Des Syst Manufact 12:JAMDSM0021
Li X, He T, Rahman M (2005) Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer. Wear 259:1207–1214
Malshe A, Rajurkar K, Samant A, Hansen HN, Bapat S, Jiang W (2013) Bio-inspired functional surfaces for advanced applications. CIRP Ann 62:607–628
Mukaida M, Yan J (2017) Ductile machining of single-crystal silicon for microlens arrays by ultraprecision diamond turning using a slow tool servo. Int J Mach Tools Manuf 115:2–14
Ottevaere H, Cox R, Herzig H-P, Miyashita T, Naessens K, Taghizadeh M, Völkel R, Woo H, Thienpont H (2006) Comparing glass and plastic refractive microlenses fabricated with different technologies. J Opt A Pure Appl Opt 8:S407
Pantea C (2004) Kinetics of diamond-silicon reaction under high pressure-high temperature conditions. Texas Christian University
Peng Y, Jiang T, Ehmann K (2014) Research on single-point diamond fly-grooving of brittle materials. Int J Adv Manuf Technol 75:1577–1586
Sanz-Navarro C, Kenny S, Smith R (2004) Atomistic simulations of structural transformations of silicon surfaces under nanoindentation. Nanotechnology 15:692
Skorupa W, Yankov R (1996) Carbon-mediated effects in silicon and in silicon-related materials. Mater Chem Phys 44:101–143
Tamang A, Sai H, Jovanov V, Bali SI, Matsubara K, Knipp D (2016) On the interplay of interface morphology and microstructure of high-efficiency microcrystalline silicon solar cells. Sol Energy Mater Sol Cells 151:81–88
Uddin MS, Seah K, Li X, Rahman M, Liu K (2004) Effect of crystallographic orientation on wear of diamond tools for nano-scale ductile cutting of silicon. Wear 257:751–759
Xiao G, To S, Jelenković E (2015) Effects of non-amorphizing hydrogen ion implantation on anisotropy in micro cutting of silicon. J Mater Process Technol 225:439–450
Xie J, Zhuo Y, Tan T (2011) Experimental study on fabrication and evaluation of micro pyramid-structured silicon surface using a V-tip of diamond grinding wheel. Precis Eng 35:173–182
Yan J, Asami T, Harada H, Kuriyagawa T (2009) Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining. Precis Eng 33:378–386
Yan J, Zhang Z, Kuriyagawa T (2011) Effect of nanoparticle lubrication in diamond turning of reaction-bonded SiC. IJAT 5:307–312
Yu D, Wong Y, Hong G (2011) Ultraprecision machining of micro-structured functional surfaces on brittle materials. J Micromech Microeng 21:095011
Zhang S, To S (2013) A theoretical and experimental study of surface generation under spindle vibration in ultra-precision raster milling. Int J Mach Tools Manuf 75:36–45
Zhang J, Zhang J, Cui T, Hao Z, Al Zahrani A (2017) Sculpturing of single crystal silicon microstructures by elliptical vibration cutting. J Manuf Process 29:389–398
Zong W, Sun T, Li D, Cheng K, Liang Y (2008) XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer. Int J Mach Tools Manuf 48:1678–1687
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Sun, Z., To, S. (2023). Ductile Machining Mechanism for Micro-structure by Ultra-Precision Raster Milling. In: To, S., Wang, S. (eds) Fly Cutting Technology for Ultra-precision Machining. Precision Manufacturing. Springer, Singapore. https://doi.org/10.1007/978-981-13-3261-6_12-1
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DOI: https://doi.org/10.1007/978-981-13-3261-6_12-1
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Ductile Machining Mechanism for Micro-structure by Ultra-Precision Raster Milling- Published:
- 23 May 2023
DOI: https://doi.org/10.1007/978-981-13-3261-6_12-2
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Ductile Machining Mechanism for Micro-structure by Ultra-Precision Raster Milling- Published:
- 05 April 2023
DOI: https://doi.org/10.1007/978-981-13-3261-6_12-1