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Machining characteristics on the ultra-precision dicing of silicon wafer

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Abstract

Recently, the slightest damage to a circuit can cause great damage due to the sizes of semiconductor chips becoming smaller. To prevent damage to the circuit, the dicing process for silicon wafer must be controlled. In this study, the relationship between the chipping effect and the force of dicing was analyzed. The rate of chipping decreased with a decrease in the force of dicing. The force of dicing also decreased according to a lower feed rate and higher blade speed. The lower feed rate and the higher blade speed must be controlled to achieve a chip-free process.

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Acknowledgment

This work was supported by a research grant from Inha University, South Korea.

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Authors and Affiliations

  1. School of Mechanical Engineering, Pusan National University, San 30, Jangjeon-Dong, Kumjung-Ku, Busan, 609-735, South Korea

    Sung-Chul Kim, Nam-Hun Kim & Hae-Do Jeong

  2. Department of Mechanical Engineering, Inha University, 253, Yonghyun-Dong, Nam-Gu, Incheon, 402-751, South Korea

    Eun-Sang Lee

Authors
  1. Sung-Chul Kim
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  2. Eun-Sang Lee
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  3. Nam-Hun Kim
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  4. Hae-Do Jeong
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Correspondence to Eun-Sang Lee.

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Kim, SC., Lee, ES., Kim, NH. et al. Machining characteristics on the ultra-precision dicing of silicon wafer. Int J Adv Manuf Technol 33, 662–667 (2007). https://doi.org/10.1007/s00170-006-0499-1

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  • DOI: https://doi.org/10.1007/s00170-006-0499-1

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