Aluminum composite materials for multichip modules

Abstract

In the intensive materials development activities for electronic packaging and thermal management applications, the subclass of materials in which SiC particles reinforce aluminum alloy matrices has emerged as one with an especially attractive combination of physical properties, manufacturing flexibility, and cost. One benefit of these materials is the ability to tailor the physical properties through the selection of both reinforcement and alloy variables to match the thermal expansion coefficient of other electronic materials. In addition, the manufacturing flexibility of the various processes allows for shape complexity as well as selective reinforcement placement in the component to optimize system producibility. Finally, because raw materials are inherently inexpensive and low-cost production routes have been identified, aluminum composites may offer a range of cost-effective solutions to emerging problems in electronic packaging and thermal-management applications.