Skip to main content
SpringerLink
Log in

Microstructure and properties of Al/Sip composites for thermal management applications

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

Aluminum matrix composite reinforced with high amount of Si particle is an advanced electronic packaging material used in thermal management. In this work, Al/Sip composites with different Si contents were prepared by rapid solidification and hot pressing. Fine and homogeneous microstructures with defect-free were achieved, and no detrimental reaction was detected. The typical thermo-physical properties such as the thermal conductivity and coefficient of thermal expansion (CTE) of the Al/Sip composites were acceptable as electronic packaging material for semiconductor devices. The CTE increased gradually with the temperature. Additionally, the mechanical properties of the composites were measured. The technological performance (workability, platability, and laser weldability) of the composites were also evaluated.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7

Similar content being viewed by others

References

  1. J.H. Yu, C.B. Wang, Q. Shen, L.M. Zhang, Mater. Des. 41, 198–202 (2012)

    Article  Google Scholar 

  2. C. Zweben, JOM 50, 47–51 (1998)

    Article  Google Scholar 

  3. S.C. Hogg, A. Lambourne, A. Ogilvy, P.S. Grant, Scr. Mater. 55, 111–114 (2006)

    Article  Google Scholar 

  4. M. Schöbel, W. Altendorfer, H.P. Degischer, S. Vaucher, T. Buslaps, M.D. Michiel, M. Hofmann, Compos. Sci. Technol. 71, 724–733 (2011)

    Article  Google Scholar 

  5. X.H. Qu, L. Zhang, M. Wu, S.B. Ren, Prog. Nat. Sci. Mater. Int. 21, 189–197 (2011)

    Article  Google Scholar 

  6. Q. Zhang, G. Wu, L. Jiang, G. Chen, Mater. Chem. Phys. 82, 780–785 (2003)

    Article  Google Scholar 

  7. M. Kida, L. Weber, C. Monachon, A. Mortensen, J. Appl. Phys. 109, 1–8 (2011)

    Article  Google Scholar 

  8. Q. Zhang, L. Jiang, G. Wu, J. Mater. Sci.: Mater. Electron. 25, 604–608 (2014)

    Google Scholar 

  9. Y. Jia, F. Cao, S. Scudino, P. Ma, H. Li, L. Yu, J. Eckert, J. Sun, Mater. Des. 57, 585–591 (2014)

    Article  Google Scholar 

  10. Y.Q. Liu, S.H. Wei, J.Z. Fan, Z.L. Ma, T. Zuo, J. Mater. Sci. Technol. 30, 417–422 (2014)

    Article  Google Scholar 

  11. T.S. Srivatsan, T.S. Sudarshan, E.J. Lavernia, Prog. Mater. Sci. 39, 317–409 (1995)

    Article  Google Scholar 

  12. P.J. Ward, H.V. Atkinson, P.R.G. Anderson, L.G. Elias, B. Garcia, L. Kahlen, J.M. Rodriguez-ibabe, Acta Mater. 44, 1717–1727 (1996)

    Article  Google Scholar 

  13. T.A. Hahn, R.W. Armstrong, Int. J. Thermophys. 9, 179–193 (1988)

    Article  Google Scholar 

  14. S. Ren, X. He, X. Qu, I.S. Humail, Y. Li, Mater. Sci. Eng. B 138, 263–270 (2007)

    Article  Google Scholar 

  15. C.R. Berry, J. Appl. Phys. 24, 658–659 (1953)

    Article  Google Scholar 

  16. G. Mi, C. Li, K. Wang, L. Chen, Mater. Res. Innovations 17, 182–185 (2013)

    Article  Google Scholar 

  17. S.H. Lee, S.Y. Kwon, H.J. Ham, Thermochim. Acta 542, 2–5 (2012)

    Article  Google Scholar 

  18. Y. Li, J. Liu, W. Wang, G. Liu, Trans. Nonferrous Met. Soc. China 23, 970–976 (2013)

    Article  Google Scholar 

  19. X. Wang, G. Wu, R. Wang, Z. Xiu, K. Yu, Trans. Nonferrous Met. Soc. China 17, 1039–1042 (2007)

    Google Scholar 

  20. Sandvik Osprey Ltd, (2014). http://www.cealloys.com/tech_info.htm

Download references

Acknowledgments

The authors would like to thank for the financial support from the National Key Fundamental Research Project of China (JPPT-125-14).

Author information

Authors and Affiliations

  1. School of Materials Science and Engineering, Central South University, Changsha, 410083, People’s Republic of China

    Zhiyong Cai, Richu Wang, Chun Zhang, Chaoqun Peng & Linqian Wang

Authors
  1. Zhiyong Cai
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Richu Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Chun Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Chaoqun Peng
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Linqian Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Richu Wang.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Cai, Z., Wang, R., Zhang, C. et al. Microstructure and properties of Al/Sip composites for thermal management applications. J Mater Sci: Mater Electron 26, 4234–4240 (2015). https://doi.org/10.1007/s10854-015-2973-8

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-015-2973-8

Keywords

Search

Navigation