Abstract
The objective of this study is to obtain detailed information for the micro fabrication of lead frames by applying spray technology to wet etching process. Wet etching experiments were performed with different etching parameters such as injection pressure, distance from nozzle tip to etched substrate, nozzle pitch and etchant temperature. The characteristics of single and twin spray were measured to investigate the correlation between the spray characteristics and the etching characteristics. Drop size and velocity were measured by Phase-Doppler Anemometer (PDA). Four liquids of different viscosity were used to reveal the effects of viscosity on the spray characteristics. The results indicated that the shorter the distance from nozzle tip and the nozzle pitch, the larger etching factor became. The average etching factor had good positive correlation with average axial velocity and impact force. It was found that the etching characteristics depended strongly on the spray characteristics.
Similar content being viewed by others
References
Abate, K., 2000,“Photochemical Etching of Metals,”Metal Finishing, Vol. 98, No. 6, pp. 414–417.
Allen, D. M., 1986,“The Principles and Practice of Photochemical Machining and Photo- etching,” Adam Hilger, Bristol and Boston.
Chang, C. T. and Farrell, P. V., 1997,“A Study on the Effects of Fuel Viscosity and Nozzle Geometry on High Injection Pressure Diesel Spray Characteristics,”SAE Paper 970353, pp. 235–244.
Choi, Y. C, Jung, J. W. and Kim, D. J., 2001,“Characteristics of Spray from Pressure-Swirl Nozzle with Different Liquid Properties and Nozzle Geometries,”Trans, of KSME (B), Vol. 25, No. 12, pp. 1813–1820.
Geissler, M., Schmid, H., Michel, B. and Delamarche, E., 2003,“Selective Wet Etching of Microcontact Printed Cu Substrates with Control over the Etch Profile,”Microelectronic Engineering, Vol. 67, pp. 326–332.
Jung, J.W. and Kim, D. J., 2004,“A Study on Effect of Spray Characteristics on Etching Characteristics in Micro Fabrication System,”Trans, of KSME (B), Vol. 28, No. 1, pp. 109- 117.
Jung, J. W., Kim, Y. J. and Kim, D. J., 2004,“Correlation Between Spray Characteristics and Etching Characteristics in Twin Spray,”Trans, of KSME (B), Vol. 28, No. 4, pp. 449–455.
Sdiahmed, M. M., Brown, R. B. and Darvishvand, M., 1999,“Drop-Size/Velocity Correlations at Formation of Sprays from Fan Nozzles,”Transactions of the ASAE, Vol. 42 (6), pp. 1557–1564.
Sundaram, K. B., Sah, R. E., Baumann, H., Balachandran, K. and Todi, R. M., 2003,“Wet etching Studies of Silicon Nitride Thin Films Deposited by Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor Deposition,”Mcroelectronic engineering, Vol. 70, pp. 109–114.
Ueda, R., Toki, S., Tanizaki, Y., Sugiutra T. and Asakura, S., 1994,“Principles of Photo- etching in the Fabrication of Fine-Pitch Lead Frames,”Metal finishing, Vol. 92, No. 1, pp. 29- 31.
Visser, A. and Buhlert, M., 2001,“Theoretical and Practical Aspects of the Miniaturization of Lead Frames by Double Sided Asymmetrical Spray Etching,”Journal of Materials Processing Technology, Vol. 115, pp. 108–113.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Jung, JW., Choi, GM. & Kim, D.J. Experimental study on spray etching process in micro fabrication of lead frame. KSME International Journal 18, 2294–2302 (2004). https://doi.org/10.1007/BF02990234
Received:
Revised:
Published:
Issue Date:
DOI: https://doi.org/10.1007/BF02990234