Abstract
The wetting behaviors between the quaternary Sn-8.55Zn-1Ag-XAl solder alloys and Cu have been investigated with the wetting balance method. The Al contents, x, of the quaternary solder alloys investigated were 0.01–0.45 wt.%. The results of differential scanning calorimeter (DSC) analysis indicate that the solders exhibit a solid-liquid coexisting range of about 7–10°C. The solidus temperature of the quaternary Sn-8.55Zn-1Ag-XAl solder alloys is about 198.2°C, while the liquidus temperatures are 205–207°C. The experimental results showed that the wettability of the Sn-8.55Zn-1Ag-XAl solder alloys is improved by the addition of Al. The mean maximum wetting force of the solders with Cu is within 0.75–1.18 mN and the mean wetting time is around 1.0–1.1 sec, better than the ∼1.3 sec of eutectic Sn-9Zn and Sn-8.55Zn-1Ag solder alloys. The addition of Al also depresses the formation of ε-Ag-Zn compounds at the interface between Sn-8.55Zn-1Ag-XAl solders and copper.
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References
S. Choi, T.R. Bieler, J.P. Lucas, and K.N. Subramanian, J. Electron. Mater. 28, 1209 (1999).
C.J. Chen and K.L. Lin, J. Electron. Mater. 29, 1007 (2000).
F.G. Yost, The Metal Science of Joining, eds. M.J. Cieslak, J.H. Perepezko, S. Kang, and M.E. Glicksman (Warrendale, PA: TMS, 1992), pp. 49–65.
J. Glazer, Int. Mater. Rev. 40, 65 (1995).
M. McCormack, S. Jin, and H.S. Chen, J. Electron. Mater. 23, 687 (1994).
K.L. Lin, L.H. Wen, and T.P. Liu, J. Electron. Mater. 27, 97 (1998).
M. Yamashita, S. Tada, and K. Shiokawa, U.S. Patent No. US006179935B1, Jan. 30, 2001.
K.L. Lin and T.P. Liu, Mater. Chem. Phys. 56, 171 (1998).
M. Yamashita, S. Tada, and K. Shiokawa, U.S. Patent No. US006156132A, Dec. 5, 2000.
M. McCormack and S. Jin, J. Electron. Mater. 23, 635 (1994).
K.L. Lin and T.P. Liu, Oxid. Met. 50 (3/4), 255 (1998).
K.L. Lin and Y.C. Wang, J. Electron. Mater. 27, 1205 (1998).
K.L. Lin, F.C. Chung, and T.P. Liu, Mater. Chem. Phys. 53, 55 (1998).
H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer, and M. Fine, J. Electron. Mater. 26 (1997).
S.P. Yu, M.H. Hon, and M.C. Wang, J. Electron. Mater. 16, 76 (2001).
Z. Mei and J.M. Morris, Jr., J. Electron. Mater. 21, 599 (1992).
W.J. Plumbridge, J. Mater. Sci. 31, 2501 (1996).
J. Glazer, J. Electron. Mater. 23, 693 (1994).
P.T. Vianco, The Metal Science of Joining, eds. M.J. Ciesalak, J.H. Perepezko, S. Kang, and M.E. Glicksman (Warrendale, PA: TMS, 1992), pp. 265–285.
J.Y. Park, C.S. Kang, and J.P. Jung, J. Electron. Mater. 28, 1256 (1999).
J.Y. Park, J.P. Jung, and C.S. Kang, IEEE Trans. Comp. Packag. Technol. 22, 372 (1999).
T.B. Massalski, J.L. Murray, L.H. Bennett, H. Baker, and L. Kacprzak, Binary Alloy Phase Diagram, 2nd ed. (New York: ASM, 1987), pp. 980–981.
M. McCormack, and S. Jin, J. Electron. Mater. 23, 715 (1994).
T.B. Massalski, J.L. Murray, L.H. Bennett, H. Baker, and L. Kacprzak, Binary Alloy Phase Diagram, 2nd ed. (New York: ASM, 1987), pp. 184–185.
T.B. Massalski, J.L. Murray, L.H. Bennett, H. Baker, and L. Kacprzak, Binary Alloy Phase Diagram, 2nd ed. (New York: ASM, 1987), pp. 85–86.
R. Hultgren, P.D. Desai, D.T. Hawkins, M. Gleiser, and K.K. Kelley, Selected Values of the Thermodynamic Properties of Binary Alloys (Metals Park, OH: ASM, 1973), pp. 115–822.
K.L. Lin and H.M. Hsu, J. Electron. Mater. 30, 1068 (2001).
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Cheng, S.C., Lin, K.L. The thermal property of lead-free Sn-8.55Zn-1Ag-XAl solder alloys and their wetting interaction with Cu. J. Electron. Mater. 31, 940–945 (2002). https://doi.org/10.1007/s11664-002-0187-3
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DOI: https://doi.org/10.1007/s11664-002-0187-3