Abstract
The purpose of this paper is to present a mathematical representation of the forces that govern the final positioning of Si chips in flip-chip technology. These forces arise from the tendency of the system to minimize its free energy; and in the paper, we are presenting a mathematical technique, based on the public domain Surface Evolver computational package. By explicitly calculating the restoring forces, we could examine the effect of system geometry and specifically examine the role played by the pad shape in affecting these phenomena. This computational technique is thought to have a considerable potential for addressing a broad range of related problems in flip chip technology.
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Deering, S.E., Szekely, J. Mathematical modeling of alternative pad designs in flip-chip soldering processes. J. Electron. Mater. 23, 1325–1334 (1994). https://doi.org/10.1007/BF02649898
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DOI: https://doi.org/10.1007/BF02649898