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Effect of orientation on crystallographic cracking in notched nickel-base superalloy single crystal subjected to far-field cyclic compression

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Abstract

The effects of crystallographic orientation on the fatigue crack initiation and growth under far-field cyclic compression are discussed in single crystals of nickel-base superalloy MAR-M200. Results indicate that cracking occurs primarily due to planar slip on the {111}-type planes. Crystallographic cracking can occur on two or more slip planes simultaneously, but through-thickness cracks are not observed. In addition, it has been shown that the threshold stress intensity for crack initiation shows a strong dependence on orientation. The threshold stress intensity for crack growth in cyclic compression is 5 to 10 times the threshold for crack growth in cyclic tension.

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Aswath, P.B. Effect of orientation on crystallographic cracking in notched nickel-base superalloy single crystal subjected to far-field cyclic compression. Metall Mater Trans A 25, 287–297 (1994). https://doi.org/10.1007/BF02647974

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