Study on fracture behavior of ferroelectric ceramics under combined electromechanical loading by using a moiré interferometry technique

Abstract

This paper discusses an in situ observation of fracture behavior around a crack tip in ferroelectric ceramics under combined electromechanical loading by use of a moiré interferometry technique. The deformation field induced by the electric field and the stress concentration near the crack tip in three-points bending experiments was measured. By analysis of the moiré images it is found that under a constant mechanical load, the electric field almost has no effect on the crack extension in the case that the directions of the poling, electric field and crack extension are perpendicular to each other. When the poling direction is parallel to the crack extension direction and perpendicular to the electric field, the strain decreases faster than that calculated by FEM with and without electrical loading as one goes away from the crack tip. In addition, as the electric field intensity increases, the strain near the crack tip increases, and the strain concentration becomes more significant.