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A new ultrasonic measurement system for the cure monitoring of thermosetting resins and composites

  • Polymers
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Abstract

Measurements of the ultrasonic sound speed of thermosetting resins and composites can be used as an in-process cure monitoring technique. Ultrasonic measurements have an advantage over other in-process techniques in that ultrasonic sensors do not make contact with the part (thus leaving no imbedded sensor or witness mark) and can make true bulk measurements of the part. A new commercially available ultrasonic cure monitoring system has been developed which easily enables ultrasonic measurements to be made in compression molding, resin transfer molding, and autoclave processes. Advancements in ultrasonic sensor technology enable the sensor to maintain good coupling to the part during thermal cycling to 260‡C. Data is presented showing the change in ultrasonic sound speed during the compression molding of a graphite-epoxy prepreg. The data shows a good relationship to the ionic conductivity and resistivity data collected via dielectric cure monitoring.

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Authors and Affiliations

  1. Micromet Instruments, Inc., 7 Wells Avenue, 021 59, Newton Centre, MA, USA

    D. D. Shepard & K. R. Smith

Authors
  1. D. D. Shepard
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  2. K. R. Smith
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Additional information

This effort was sponsored by the Manufacturing Technology Directorate, Wright Laboratory (WL/MTX), Air Force Material Command, USAF, under cooperative agreement award(s) to NCMS. The U. S. Government is authorized to reproduce and distribute reprints for Governmental purposes notwithstanding any copyright notation thereon. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of Wright Laboratory or the U.S. Government.

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Shepard, D.D., Smith, K.R. A new ultrasonic measurement system for the cure monitoring of thermosetting resins and composites. Journal of Thermal Analysis 49, 95–100 (1997). https://doi.org/10.1007/BF01987425

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  • DOI: https://doi.org/10.1007/BF01987425

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