Abstract
The physical processes occurring at the surface and in the bulk of an oxide during plasma oxidation or anodization are discussed. It is shown that (i) the majority of oxygen ions used in the growth are formed by electron-assisted surface processes, (ii) the nature of the oxide surface and especially the presence of electrode contamination can have a determinant role in the oxygen exchange between the plasma and the oxide, and (iii) ion space charge can control the anodization kinetics. Two applications (formation of the insulating barrier of Josephson junctions, and GaAs MOSFET devices) are presented.
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Gourrier, S., Bacal, M. Review of oxide formation in a plasma. Plasma Chem Plasma Process 1, 217–232 (1981). https://doi.org/10.1007/BF00568831
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DOI: https://doi.org/10.1007/BF00568831