Abstract
Analysis of load and current transients accompanying discontinuous transgranular stress corrosion cracking (T-SSC) are analyzed in light of fractographic evidence, resulting in a model for T-SCC which involves corrosion-enhanced cleavage. The model accounts for the crystallography and microstructural features of the resulting fracture, the orientation dependence of the fracture process, and the role of the electrochemical/alloy environment.
Similar content being viewed by others
References
R.Bakish and W.D.Robertson, Acta Metallurgica 3 (1995) 513–15; American Institute of Mining, Metallurgical, and Petroleum Engineers 206 (1956) 1277–82; Acta Metallurgica 4 (1956) 342–351.
W.F.Flanagan, LijunZhong and B.D.Lichter, Metallurgical Transactions 24 (1993) 553–559.
J.B. Lee, Ph.D thesis, Studies on De-Alloying and its Relationship to Transgranular Stress-Corrosion Cracking in Copper-25at percent Gold Single Crystals, Vanderbilt University, Nashville, TN (1990).
B.D. Lichter, R.M. Bhatkal and W.F. Flanagan, Parkins Symposium on Fundamental Aspects of Stress Corrosion Cracking, TMS, Warrendale, PA (1992) 279–302.
Mengke Zhu, Ph.D thesis, A Study of Transgranular Stress-Corrosion Cracking in Copper-25a percent Gold Single Crystals, Vanderbilt University, Nashville, TN (1990).
W.F.Flanagan, MinWang, M.Zhu and B.D.Lichter, Metallurgical and Materials Transactions 25A (1994) 1391–1401.
K.R. Evans and W.F. Flanagan, Philosophical Magazine (1968) 535–551.
K.R.Evans, D.J.Bailey and W.F.Flanagan, Physica Status Solidi 22 (1967) 607–616.
R.M. Bhatkal, Masters thesis, Electrochemical Behavior of Freshly Exposed Copper-Gold Alloy Surfaces in Chloride Solutions, Vanderbilt University, Nashville, TN (1991).
H.Tada, P.C.Paris and G.R.Irwin, The Stress Analysis of Cracks Handbook, Del Research Corp., St. Louis, MO (1985) 2.10–2.12.
Min Wang, Masters thesis, Microcrack Growth During Transgranular Stress-Corrosion cracking of Disordered Copper-25 percent Gold Single Crystals, Vanderbilt University, Nashville, TN (1993).
J.O'M.Bokris and A.K.N.Reddy, Modern Electrochemistry 2, Plenum Publishing Corporation, NY (3rd ed.) (1977) 1177.
W.F.Flanagan, P.Bastias and B.D.Lichter, Acta Metallurgica 39 (1991) 695–705.
A.N.Stroh, Proceedings of the Royal Society 223A (1954) 404–414; Proceedings of the Royal Society 232A (1955) 548–560; Philosophical Magazine 1 (1956) 489–502.
Joung Soo Kim, Ph.D thesis, Electrochemistry and Transgranular Stress-Corrosion Cracking of Alpha-Brass Single Crystals in Film-Free Aqueous Ammonia Solutions, Vanderbilt University, Nashville, TN (1985).
R.G. Hoagland, Sanjay Sondhi and W.F. Flanagan: unpublished work, Washington State University (1995); see also: R.G. Hoagland, Journal of Materials Research 9 (1994) 1805–1819, and R.G. Hoagland and H.L. Heinisch, Journal of Materials Research 7 (1992) 2080–2088.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Flanagan, W.F., Lichter, B.D. A mechanism for transgranular stress-corrosion cracking. Int J Fract 79, 121–135 (1996). https://doi.org/10.1007/BF00032930
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/BF00032930