Abstract
The following approach of a fluidic based self-assembly process uses the surface forces for a precise handling and positioning of small devices for a roll-to-roll manufacturing. The surface, on which the device should be positioned, will be functionalized with hydrophile and hydrophobic areas. Thus water droplets can be caught on the hydrophile areas. The devices to be positioned will be placed on these droplets and due to the surface tension moved to their final position. The droplets, a solution of ultrapure water and isopropanol, are evaporating residue-free within seconds [1].
Chapter PDF
Similar content being viewed by others
References
Boufercha, N., Sägebarth, J., Othman, N., Burgard, M., Schäfer, W., Sandmaier, H.: Selfassembly of Micro Components with Microfluidics. In: Proceedings of the International Workshop on Micro- and Nano- Technologies and Systems, Moskau, pp. 45–52 (2007)
Hecker, K.: Organic and Printed Electronics, 3rd edn. VDMA Verlag GmbH, Frankfurt am Main (2009)
Gourlay, J., et al.: Light-Rolls: High throughput manufacture for LED Lighting and Displays. Display Week 2010, SID International Symposium, Society for Information Display, 2010 - Digest of Technical Papers (2010) 20110104283
MINAM – Roadmaps, http://www.micronanomanufacturing.eu
Morris, C.J., Stauth, S.A., Parviz, B.A.: Self-Assembly for Microscale and Nanoscale Packaging: Steps Toward Self-Packaging. IEE Transactions on Advanced Packaging 28(4), 600–611 (2005)
Boufercha, N., Schäfer, W., Sägebarth, J., Sandmaier, H.: Influences of Nanostructured Interfaces on Microfluidics. In: NNT International Conference on Nanoprint & Nanoimprint Technology (2007)
Fang, J., Böhringer, K.F.: Wafer-Level Packaging Based on Uniquely Orienting Self-Assembly (The DUO-SPASS Process). Journal of Microelectromechanical Systems 15(3) (June 2006)
Yeh, H.J., Smith, J.S.: Fluidic Slef-Assembly for the Integration of GaAs Light-Emitting Diodes on Si Substrates. IEEE Photonics Technology Letters 6(6) (June 1994)
Schlenker, D.: Schließventillösung für unterschiedlichste Anwendungen. adhäsion KLEBEN & DICHTEN, 16–18 (November 2010)
Author information
Authors and Affiliations
Editor information
Rights and permissions
Copyright information
© 2012 IFIP International Federation for Information Processing
About this paper
Cite this paper
Burgard, M., Schläfli, N., Mai, U. (2012). Processes for the Self-assembly of Micro Parts. In: Ratchev, S. (eds) Precision Assembly Technologies and Systems. IPAS 2012. IFIP Advances in Information and Communication Technology, vol 371. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-28163-1_5
Download citation
DOI: https://doi.org/10.1007/978-3-642-28163-1_5
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-28162-4
Online ISBN: 978-3-642-28163-1
eBook Packages: Computer ScienceComputer Science (R0)