Abstract
The physics processes causing sputtering, i.e. the removal of atoms from the surface of solids or liquids at bombardment with particles having energies from the eV to the MeV range are today mostly understood. The erosion yields calculated with computer codes for different incident parameters agree reasonably well with experimentally measured yields; the same applies to energy and angular distributions. Sputtering is widely used for surface layer analysis, for removing surface atoms for thin film deposition and for surface machining.
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Behrisch, R., Eckstein, W. (2007). Introduction and Overview. In: Sputtering by Particle Bombardment. Topics in Applied Physics, vol 110. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-44502-9_1
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DOI: https://doi.org/10.1007/978-3-540-44502-9_1
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-44500-5
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